PH3-76.2-25.4-0.21-1A

Series:	PH3
Part Status:	Active
Type:	Heat Spreader
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Adhesive
Shape:	Rectangular
Length:	3.000" (76.20mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.008" (0.21mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Copper
Material Finish:	Polyester

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Thermal - Heat Sinks play an important role in engineering physics. They are designed to draw heat currents away from electronic components and help reduce the operating power of components. PH3-76.2-25.4-0.21-1A is a type of thermal-heat sink that has gained tremendous popularity over the years. Not only is it highly effective and reliable, but it is also relatively inexpensive. This article will provide a detailed overview of the PH3-76.2-25.4-0.21-1A application field and working principle.The fields of application for PH3-76.2-25.4-0.21-1A range from consumer electronics to industrial machinery. This heat sink is suitable for a variety of electronic components, such as CPUs, GPUs, logic circuits, FPGAs, and digital signal processors (DSP). The low profile design of the PH3 makes it particularly attractive for use in smaller and space-restricted areas such as notebooks, tablets, and other portable electronic devices. Furthermore, the use of aluminum alloys and other special materials makes the PH3 ideal for transferring thermal energy effectively from one location to another.The working principle of the PH3-76.2-25.4-0.21-1A follows closely its application fields. The PH3 consists of a high-performance heat sink unit consisting of aluminum alloy base and fins. The fin design uses curved internal channels that help dissipate thermal energy rapidly and efficiently. A pair of heat pipes is connected to the fin to enhance the thermal convection and transfer heat away from the base quickly and effectively.The aluminum alloy base contains a series of embedded guides to help direct the thermal energy away from the CPU and other sensitive components, making it ideal for high-performance computers and other sensitive electronic equipment. To complement the cooling solution, the PH3 is equipped with a fan to help improve air circulation in the system. This fan is designed to spin at high speeds and is very effective in dissipating heat away from the system while providing low noise levels.In summary, the PH3-76.2-25.4-0.21-1A thermal-heat sink is an excellent solution for cooling high-performance computers and other sensitive electronic equipment due to its superior thermal performance, cost-effectiveness, and low profile design. This heat sink effectively transfers thermal energy away from CPUs and other components while helping to maintain low noise levels. Thanks to its versatile and versatile nature, the PH3-76.2-25.4-0.21-1A is suitable for a wide range of applications in consumer electronics, industrial machinery, and other challenging fields.

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