PK10M-060PP-SM1-DA

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The PK10M-060PP-SM1-DA rectangular connectors - arrays, edge type, mezzanine (board to board) - is an excellent solution for high density connector applications. It is a plug and play, 3mm pitch PIM module system with multi-row SMT contacts for power and high speed signal applications. It features a low profile design, metal alignment keys, high dielectric strength, no special requirements for pick-and-place, and a highly customizable program.

The PK10M-060PP-SM1-DA provides excellent performance in a highly compact package with a broad range of capabilities. It consists of a baseboard which includes a female connector, or receptacle, and two sideboards with male connectors, or pins. The baseboard and sideboards are mounted on the board in a preset pattern, with the sideboards mounted to the ends of the baseboard. The connectors are then soldered to the board as with any other edge connector.

The PK10M-060PP-SM1-DA supports a variety of applications, including high speed data, large I/O port control, memory, and system amplifiers. It is also well suited for power applications, providing up to 5A peak current rating. In addition, the module has a high dielectric strength rating of 0.5kV (rms) to 350V (rms) and temperature range of -55°C to +155°C.

The working principle of the PK10M-060PP-SM1-DA is fairly simple. The baseboard connector has an array of pins, while the sideboards have a corresponding array of receptacles. When the device is plugged in, the pins make an electrical connection with the receptacles on the sideboards. This allows for current to flow between the two boards, enabling the transfer of power and signals. The module also has metal alignment keys which ensure that the connector is correctly aligned when plugged in.

In addition, the PK10M-060PP-SM1-DA also has a ‘gap fill’ feature, which allows the pin and receptacle to remain in contact even when there is an uneven surface. This increases the overall reliability of the connection and makes the module suitable for various product forms and structural layouts. The gap fill feature also ensures better performance when the device is exposed to vibration or shock.

To sum up, the PK10M-060PP-SM1-DA is an excellent solution for high density connector applications. It offers a low profile design, high dielectric strength, and metal alignment keys. It also has a ‘gap fill’ feature, which increases connection reliability and allows the module to be used in various product forms and structural layouts. These features make the connector suitable for wide range applications, including high speed data, large I/O port control, memory, and system amplifiers.

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