POD(F)-R-1 Allicdata Electronics
Allicdata Part #:

POD(F)-R-1-ND

Manufacturer Part#:

POD(F)-R-1

Price: $ 10.96
Product Category:

Uncategorized

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN RF COAX RECEPT
More Detail: N/A
DataSheet: POD(F)-R-1 datasheetPOD(F)-R-1 Datasheet/PDF
Quantity: 1000
1 +: $ 9.96660
Stock 1000Can Ship Immediately
$ 10.96
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Glass etching involves the application of an etchant material onto the exposed surface of a glass material in order to produce intricate and aesthetically pleasing designs. One technique used to accomplish this is wet-etching, a process by which an acid or other etching solution is applied and allowed to ‘eat’ away at the exposed surfaces of a glass workpiece.

POD (Protective Oxide Dip) – R-1, or ‘etch on dry’, is a revolutionary etching process wherein an etchant material is applied to the surface of a glass object without the aid of a wet etchant solution. This mode of etching is simpler and faster than traditional wet etching and yields more precise and consistent results. The following is a brief description of the application field and working principle of POD (Protective Oxide Dip) – R-1 etching.

POD (Protective Oxide Dip) – R-1 etching has been found to be particularly effective on polished glass. It is also beneficial for use in the production of intricate patterns, which would otherwise be difficult or impossible to produce via wet etching. Additionally, it is suitable for the etching of glass objects that may contain lead, cadmium, or other hazardous materials. This makes it an ideal choice for production of intricate etched designs on glass products that may contain these materials.

The principle of POD (Protective Oxide Dip) – R-1 is based on the reaction between an acidic etching solution and an oxide layer on the surface of the glass product. The etching process proceeds by dipping the glass into a bath of a mixture of acid and water, and allowing it to undergo an electrochemical reaction. During this reaction, the etching solution breaks down the oxide layer on the glass to form finer etch patterns.

The POD (Protective Oxide Dip) – R-1 process is typically completed in three steps. The first step is the ‘dipping’ of the glass into the etching solution. This is followed by the ‘etching’ of the pattern into the glass, which is achieved by using a mechanical or electrical etching pen that applies the etching solution to the surface of the glass. The third and final step of the process is the ‘cleaning’ of the etched glass, which is done by dipping the glass into a cleaning solution and air-drying it.

The POD (Protective Oxide Dip) – R-1 process has been proven to be effective and relatively quick compared to traditional wet etching. It also offers a higher degree of accuracy and consistency, ensuring that intricate designs are etched with pinpoint accuracy. Additionally, the lack of hazardous materials in the etching process makes it safe to use with products that may contain hazardous materials.

In conclusion, POD (Protective Oxide Dip) – R-1 etching is a quick, safe, and reliable method for the production of intricate designs on polished glass products. It is suitable for a wide range of applications and is becoming increasingly popular as an alternative to wet etching.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VS-95-9928PBF

DIODE GENERAL PURPOSE TO220

VS-95-9928PBF Allicdata Electronics
CA3100E18-12SBA176F42F80

CB 6C 6#16 SKT RECP

CA3100E18-12SBA176F42F80 Allicdata Electronics
CA08COME36-3PB-44

CA08COME36-3PB-44

CA08COME36-3PB-44 Allicdata Electronics
CA06SST02-24-5PBF80

CA-BAYONET

CA06SST02-24-5PBF80 Allicdata Electronics
CA06EW14S-6SBF80TL05

CB 6C 6#16S SKT PLUG

CA06EW14S-6SBF80TL05 Allicdata Electronics
CA01COME14S-7SB

CAC 3C 3#16S SKT RECP LINE

CA01COME14S-7SB Allicdata Electronics