Allicdata Part #: | QCM007PC2DMC50B-ND |
Manufacturer Part#: |
QCM007PC2DMC50B |
Price: | $ 189.40 |
Product Category: | Uncategorized |
Manufacturer: | TE Connectivity Aerospace, Defense and Marine |
Short Description: | QCM007PC2DMC50B = CIRCULAR |
More Detail: | N/A |
DataSheet: | QCM007PC2DMC50B Datasheet/PDF |
Quantity: | 1000 |
5 +: | $ 172.17900 |
Specifications
Series: | * |
Part Status: | Active |
Description
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QCM007PC2DMC50B application field and working principle
QCM007PC2DMC50B is a new generation combination CVD/Laser etcher for thin film CVD deposition and etching. It is mainly used for the deposition and etching of different thin films, such as silicon dioxide, silicon nitride, aluminum, etc. It is widely used in the production of integrated circuits, sensors, MEMS devices, optoelectronic devices, displays, flat panel displays, and other fields.The QCM007PC2DMC50B is based on a combination of laser etching and Chemical Vapor Deposition (CVD). This combination gives it advantages over conventional processes, such as high deposition rates and high controllability. CVD is a type of physical vapor deposition (PVD) process used to deposit a film of a desired material onto a substrate. The substrate, usually a semiconductor wafer, is heated to a suitable temperature and different gaseous reactants are introduced. The reactants react on the heated surface and form a film on the wafer.The QCM007PC2DMC50B is a compact machine with a CVD and laser etching module. It uses a huge panel of parameters to control the process and give the desired results. It can control the pressure, temperature, concentration, flow rate, and various other parameters. With these parameters, it can, for example, deposit thin films at high quality and at a high deposition rate. This makes it an ideal tool for producing high quality micro-devices.The laser etching module of the QCM007PC2DMC50B can be used to strip a material from a surface quickly and accurately. The laser etching process uses high powered lasers to evaporate specific materials from a silicon wafer or other substrate. This allows for very precise processes like fine-tuned etching and drilling, as well as high quality patterning. The laser etching process can be used to create finer patterns than ever before and can also be used to create deep trenches, high aspect ratio features, and other fine features.The combination of laser etching and CVD makes the QCM007PC2DMC50B a unique machine with a wide variety of applications. It is a powerful tool for producing high quality products quickly and accurately, and is perfect for producing integrated circuits, sensors, MEMS devices, optoelectronic devices, displays, and flat panel displays.The specific data is subject to PDF, and the above content is for reference
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