QLC260P Allicdata Electronics

QLC260P Connectors, Interconnects

Allicdata Part #:

1003-2399-ND

Manufacturer Part#:

QLC260P

Price: $ 54.38
Product Category:

Connectors, Interconnects

Manufacturer: ITT Cannon, LLC
Short Description: CONN PLUG M 260POS SLDR ST
More Detail: N/A
DataSheet: QLC260P datasheetQLC260P Datasheet/PDF
Quantity: 411
Lead Free Status / RoHS Status: Vendor undefined / Vendor undefined
1 +: $ 49.43610
10 +: $ 46.52930
100 +: $ 39.84070
Stock 411Can Ship Immediately
$ 54.38
Specifications
Series: QLC
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Connector Usage: Daughtercard
Connector Type: Plug, Male Pins
Connector Style: --
Number of Positions: 260
Number of Positions Loaded: All
Pitch: 0.031" (0.80mm)
Number of Rows: 4
Number of Columns: --
Mounting Type: --
Termination: Solder
Contact Layout, Typical: --
Features: Actuating Camshaft Socket, Shielding, Zero Insertion Force (ZIF)
Contact Finish: Gold
Contact Finish Thickness: 40.0µin (1.02µm)
Color: --
Current Rating: 0.5A
Material Flammability Rating: --
Operating Temperature: -55°C ~ 85°C
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The QLC260P backplane connector is a specialized connector designed to connect two printed circuit boards (PCBs) and provide a reliable connection in high-speed data transmission applications. The QLC260P backplane connector has a 40-socket design with a 44-circuit interconnect arrangement. The connector has both an edge-mounted and a face-mounted form factor and is capable of delivering up to 11.7 Gbps in data transmission. It is compliant with most popular industry-standard backplane boards, including 10/100/1000BASE-T and VME64x. It is also compatible with legacy applications, such as Fast Ethernet and Synchronous Optical NETwork (SONET) standards.

The QLC260P backplane connector is based on a standard edge-card form factor, allowing it to be used in a variety of high-volume commercial and industry applications. It is designed to provide reliable pathways for signal conduction, even in the presence of physical stress, such as vibration and shock. The connector has a high-density design that facilitates efficient board-to-board connectivity. It is also designed to reduce the number of components and connection points, allowing for a more compact overall design.

The QLC260P backplane connector is based on a modular design, allowing users to customize it for their particular application. It uses an IDC (Insulated Displacement Connector) contact system that provides both signal and power connections to the backplane connector. The IDC contact system is robust and reliable, allowing for a longer life expectancy than traditional connection methods. It is also compatible with other standard IDC contact systems, making it easy to integrate into existing design architectures.

The QLC260P backplane connector also features an advanced plating system to maximize its electrical connection integrity. It utilizes a three-layer electrochemical plating system that is corrosion resistant and can reliably handle data transmission rates of up to 11.7 Gbps. The plating system is also designed to minimize crosstalk, enabling the connector to deliver clean signal transmission in high-volume applications.

The QLC260P backplane connector is a reliable, cost-effective solution for applications that demand high-speed data transmission. It is designed to provide the most efficient PCB-to-PCB connectivity and is compliant with most popular industry standards. Additionally, it is corrosion resistant and features an advanced plating system that ensures reliable signal transmission in high-volume applications. As such, the QLC260P backplane connector is an ideal choice for high-speed data transmission applications.

The specific data is subject to PDF, and the above content is for reference

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