Allicdata Part #: | R2V-CT4-38E-ND |
Manufacturer Part#: |
R2V-CT4-38E |
Price: | $ 2.16 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Ohmite |
Short Description: | HEATSINK FOR TO-247 |
More Detail: | Heat Sink TO-247 Aluminum 2.0W @ 20°C Board Level |
DataSheet: | R2V-CT4-38E Datasheet/PDF |
Quantity: | 327 |
1 +: | $ 1.96560 |
10 +: | $ 1.91142 |
25 +: | $ 1.85976 |
50 +: | $ 1.75644 |
100 +: | $ 1.65312 |
250 +: | $ 1.54980 |
500 +: | $ 1.49814 |
1000 +: | $ 1.34316 |
Specifications
Series: | R2 |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-247 |
Attachment Method: | Clip and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.500" (38.10mm) |
Width: | 1.380" (35.05mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.870" (22.10mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 1.00°C/W @ 800 LFM |
Thermal Resistance @ Natural: | 9.80°C/W |
Material: | Aluminum |
Material Finish: | Degreased |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are an integral part of any electronics system. A heat sink is a device that helps to dissipate the heat generated by the electrical components within the device. It dissipates the heat by either increasing the surface area for the heat to travel across, or by using air to carry the heat away. Heat sinks are typically made of aluminum or copper, but other materials can also be used.The R2V-CT4-38E is an air cooled thermal management component, which has been designed to be used in a wide variety of applications. The R2V-CT4-38E is a dual-interface heat sink with both air and water cooling options available. The air cooling option is ideal for smaller applications where size does not permit a larger water cooling system. The water cooling option is more suitable for larger applications that require more efficient cooling.The R2V-CT4-38E heat sink works by reducing the temperature of components with increased thermal resistance and by increasing the overall surface area. The design of the R2V-CT4-38E heat sink features active aluminum fins for increased surface area which helps to dissipate the heat more efficiently. The design includes a number of features which enable the heat to be evenly spread across the fins, which helps to reduce the temperature even further.The R2V-CT4-38E heat sink utilizes the air flow direction technology in order to ensure that the heat generated by the components is evenly distributed across the heat sink. This helps to ensure that the components are cooled efficiently and that the heat generated by the components is not concentrated in one area. The air flow direction is adjustable, so the user can adjust the airflow according to their requirements.The R2V-CT4-38E heat sink is designed to be used in a wide variety of applications. It is commonly used in industrial, telecommunications, automotive, and military applications, to name a few. The heat sink is capable of dissipating heat from a wide variety of components such as processors, graphics cards, chipsets, motherboards, and more. The R2V-CT4-38E heat sink is highly efficient and reliable and is capable of providing superior thermal performance.The R2V-CT4-38E heat sink has been designed to ensure maximum efficiency and reliability. It is manufactured using high-quality materials such as aluminum and copper, and is built to last. The R2V-CT4-38E heat sink is extremely easy to install and maintain, and is designed to meet the stringent demands of the latest electronics applications. The R2V-CT4-38E heat sink is designed to provide long-term reliability and performance and is a reliable solution for all of your heat-dissipation needs.The specific data is subject to PDF, and the above content is for reference
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