RA-T2X-64E Allicdata Electronics
Allicdata Part #:

RA-T2X-64E-ND

Manufacturer Part#:

RA-T2X-64E

Price: $ 2.27
Product Category:

Fans, Thermal Management

Manufacturer: Ohmite
Short Description: HEATSINK FOR TO-220 218 247 2.5"
More Detail: Heat Sink TO-218, TO-220, TO-247 Aluminum 4.0W @ 2...
DataSheet: RA-T2X-64E datasheetRA-T2X-64E Datasheet/PDF
Quantity: 981
1 +: $ 2.06010
10 +: $ 2.00466
25 +: $ 1.95048
50 +: $ 1.84212
100 +: $ 1.73376
250 +: $ 1.62540
500 +: $ 1.57122
1000 +: $ 1.40868
Stock 981Can Ship Immediately
$ 2.27
Specifications
Series: R
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-218, TO-220, TO-247
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 1.654" (42.00mm)
Width: 0.985" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 2.500" (63.50mm)
Power Dissipation @ Temperature Rise: 4.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 3.10°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The thermal heat sink is a type of component used in a number of industries. By dissipating heat generated by electrical components into the surrounding air, it can reduce the temperature of components to their safe operating limits. This allows engineers and technicians to create and install electrical systems in any environment, without the risk of burning out devices due to overheating.

In the telecommunications industry, the RA-T2X-64E is a particularly popular thermal heat sink used to dissipate heat from high-powered integrated circuits. It is frequently used for digital signals processing in telecommunications, satellite and cable television systems. Manufactured by Radiall, the RA-T2X-64E can easily dissipate up to 62 watts of power in a safe and reliable manner.

The RA-T2X-64E features an aluminium base plate, which is effectively connected to a copper heatsink and forcing air. This special design helps to evenly spread the heat generated by electrical components. To complete the installation, the user needs to employ thermal connection paste between the base plate and the components. The paste helps to evenly distribute the heat from the mounted components into the heatsink, allowing for the most efficient performance.

In addition to providing an effective heat dissipating platform, the RA-T2X-64E also contains an electrical fan. This fan provides further air cooling, helping to keep temperatures at an even level and improve the device’s performance. The fan is self-contained within the heatsink and, if necessary, can be replaced with no disruption to the other components.

The overall effectiveness of the RA-T2X-64E can be increased if it is properly installed in an appropriate environment. For instance, if the device is placed in an environment with higher airflow, the heat dissipation capabilities will increase, further lowering the temperature of electrical components. Additionally, since the RA-T2X-64E is able to dissipate temperatures both horizontally and vertically, it is particularly well-suited for applications that require verticle mounting, such as telecom towers.

When considering the installation of the RA-T2X-64E, it’s important to understand the device’s limitations. The device has a fan speed of 4500 RPM with a maximum airflow of 70CFM, making it unsuitable for particularly demanding applications. The capacity of the device is also limited as it is designed to dissipate only up to 62 watts of power.

In conclusion, the RA-T2X-64E is an excellent thermal heatsink that is well-suited for many telecom and digital processing applications. It is easy to install and comes pre-configured with a powerful fan for extra cooling power. Additionally, the device has an impressive capacity, being able to efficiently dissipate up to 62 watts of power. Lastly, the RA-T2X-64E allows for vertical installation, making it an ideal choice for telecom tower cooling solutions.

The specific data is subject to PDF, and the above content is for reference

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