RT2202B7TR13

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The RT2202B7TR13 is a series of resistor networks, arrays, and related components that are used to facilitate simultaneous electrical and thermal performance. This product line effectively reduces noise to improve overall performance and accuracy. This application field and working principle marks an improved era for design engineers to bridge gaps between manual and automated testing.

This resistor series is especially suitable for wireless applications, such as mobile and LTE. It is designed with 10 parallel resistors that provide the necessary electrical current handling capacity, while the resistors are spaced evenly to ensure uniform power dissipation.

The LT2262B7TR13 uses a chip scale package technology which keeps the sizes of the components to the minimum so that the components occupy very less space. This technology also reduces temperatures as the chip size is maintained to a minimum. The thermal resistance is 2°C/W and allows room for the temperature rise which is caused by the power dissipation.

The design of the network is also very stable so that the design engineer has a wide choice of parameters such as resistance, voltage, and power. The design also ensures excellent temperature stability that allows the device to resist temperature fluctuations and keep its resistance values constant over the temperature range specified.

The RT2202B7TR13 offers many advantages such as wide resistance range of up to 50 ohms, extremely low temperature coefficient of less than 12 μg/οhms. It also has a very high tolerance of up to 0.005%.

In addition, the RT2202B7TR13 allows for more efficient thermal handling. Heat generated by the heating element is evenly distributed throughout the copper matrixes ensuring better temperature control. The thermal time constant is also improved as there is a larger contact area between the chips. This improves the overall response time of the device.

These improved features make the RT2202B7TR13 the ideal component for various wireless communication applications. Its high precision, fast response time, and excellent thermal control properties are a great asset to any design engineer, and its thermal design supports increased power densities.

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