S25FL032P0XMFI003 Integrated Circuits (ICs) |
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Allicdata Part #: | 1274-1133-2-ND |
Manufacturer Part#: |
S25FL032P0XMFI003 |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Cypress Semiconductor Corp |
Short Description: | IC FLASH 32M SPI 104MHZ 16SOIC |
More Detail: | FLASH - NOR Memory IC 32Mb (4M x 8) SPI 104MHz 16... |
DataSheet: | S25FL032P0XMFI003 Datasheet/PDF |
Quantity: | 1000 |
Series: | FL-P |
Packaging: | Tape & Reel (TR) |
Part Status: | Obsolete |
Memory Type: | Non-Volatile |
Memory Format: | FLASH |
Technology: | FLASH - NOR |
Memory Size: | 32Mb (4M x 8) |
Clock Frequency: | 104MHz |
Write Cycle Time - Word, Page: | 5µs, 3ms |
Memory Interface: | SPI |
Voltage - Supply: | 2.7 V ~ 3.6 V |
Operating Temperature: | -40°C ~ 85°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 16-SOIC (0.295", 7.50mm Width) |
Supplier Device Package: | 16-SOIC |
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Memory technology has been used in computers and computer systems for quite some time, and is a critical component in the operation of any device that requires a substantial amount of storage and retrieval. The S25FL032P0XMFI003 is a new type of memory available on the market today, and one that has many advantages over other types of memory. This article will discuss the application field and main working principle of the S25FL032P0XMFI003, explaining how it can be used in a variety of computing applications.
Application Fields
The S25FL032P0XMFI003 has a number of application fields, and the technology is being used in a variety of industries and applications. It is primarily used in consumer electronics and RFID solutions, as well as in the automotive and defence industries. In consumer electronics, it can be used as a flash-based memory solution, providing a reliable and cost-efficient way to store and retrieve data. In RFID solutions, the S25FL032P0XMFI003 provides a level of security that is usually not seen with other types of memory. In the automotive and defence industries, the memory can be used for storing critical data, such as vehicle sensor readings and mission-critical information.
Working Principle
The S25FL032P0XMFI003 makes use of a 3D multi-level cell (MLC) structure to store data, which allows it to store more data in the same amount of space. This structure helps to increase the capacity of the memory, while also potentially reducing the power consumption of the device. The device is composed of four memory die, which are organized as a stacked chip package. Through the use of multiple dies, the S25FL032P0XMFI003 is able to read and write data to each die individually, allowing for faster read and write speeds. Furthermore, the memory is designed to be resistant to environmental conditions, making it suitable for use in a wide range of applications.
The S25FL032P0XMFI003 also makes use of an advanced error correction code (ECC) technology, which allows it to detect and correct errors that may occur during the reading and writing of data. This prevents data from being corrupted or lost, and helps to ensure that the data is always reliable. Additionally, the device also makes use of multiplexing technology, which allows it to transfer data between devices at faster speeds.
Conclusion
The S25FL032P0XMFI003 is a new type of memory available on the market today, and one that has many advantages over other types of memory. It is primarily used in consumer electronics, RFID solutions, automotive, and defence industries, and makes use of a 3D multi-level cell (MLC) structure to store data. Additionally, the device makes use of an advanced error correction code (ECC) technology, which allows it to detect and correct errors that may occur during the reading and writing of data. This makes it a reliable, powerful, and cost-efficient type of memory for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference
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