
Allicdata Part #: | S25FL132K0XMFB013-ND |
Manufacturer Part#: |
S25FL132K0XMFB013 |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Cypress Semiconductor Corp |
Short Description: | IC FLASH 32M SPI 108MHZ 8SO |
More Detail: | FLASH - NOR Memory IC 32Mb (4M x 8) SPI - Quad I/O... |
DataSheet: | ![]() |
Quantity: | 1000 |
Series: | FL1-K |
Packaging: | Tape & Reel (TR) |
Part Status: | Last Time Buy |
Memory Type: | Non-Volatile |
Memory Format: | FLASH |
Technology: | FLASH - NOR |
Memory Size: | 32Mb (4M x 8) |
Clock Frequency: | 108MHz |
Write Cycle Time - Word, Page: | 3ms |
Memory Interface: | SPI - Quad I/O |
Voltage - Supply: | 2.7 V ~ 3.6 V |
Operating Temperature: | -40°C ~ 105°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 8-SOIC (0.209", 5.30mm Width) |
Supplier Device Package: | 8-SO |
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S25FL132K0XMFB013 is a type of non-volatile flash memory. It is a very popular memory chip due to its high capacity and excellent performance. This memory chip is developed by the world’s largest memory chip manufacturer – Samsung. The S25FL132K0XMFB013 is often used in a variety of applications, including digital cameras, MP3 players, portable data storage, and gaming consoles. It is also used in many industrial applications.
The S25FL132K0XMFB013 is a memory chip that uses the two-level NOR architecture. This architecture is used to divide the energy and speed requirements of the chip. The two-level NOR architecture is divided into two separate layers: the static random access memory (SRAM) layer and the flash memory layer. The SRAM layer is used to store data quickly and temporarily, while the flash memory layer is used for long-term storage of data.
In addition to the two-level NOR architecture, the S25FL132K0XMFB013 also features a range of features that make it ideal for many applications. It offers fast read and write speeds, high data transfer rates, and a high endurance rate. It has a wide temperature range and can operate from 0°C to 85°C. It also features a low power consumption, making it ideal for applications that require low power. Finally, its built-in Error Correcting Code (ECC) ensures highly reliable data storage and processing.
The S25FL132K0XMFB013 is designed to meet the demands of applications characterizing high read and write performance. The high read/write speeds, its low power consumption, and its ability to withstand extreme temperatures make it perfect for industrial, automotive, and mobile applications. Additionally, its built-in ECC ensures highly reliable data storage, even when exposed to extreme conditions. It is also considered to be one of the most reliable memory chips on the market, with a extremely low failure rate.
The S25FL132K0XMFB013 is available in a variety of form factors, making it a versatile memory chip. It can be purchased in dip, SOJ, TSOP, and MLF packages. It also has a variety of configurations available, including different densities, or die sizes, as well as a range of speeds and supply voltages. With these options, it is capable of meeting the needs of even the most demanding applications.
In summary, the S25FL132K0XMFB013 is a highly reliable, high performance memory chip that is well-suited for a variety of applications. It offers high speeds, low power consumption, and a built-in ECC for reliable data storage. It is available in a range of form factors and configurations, making it suitable for a wide range of applications. Furthermore, it is one of the most reliable memory chips on the market, and is an excellent choice for industrial, automotive, and mobile applications.
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