SFEM008GB1EA1TO-I-GE-111-STD Allicdata Electronics
Allicdata Part #:

1052-1327-ND

Manufacturer Part#:

SFEM008GB1EA1TO-I-GE-111-STD

Price: $ 13.77
Product Category:

Integrated Circuits (ICs)

Manufacturer: Swissbit
Short Description: IC FLASH 64G EMMC 153LFBGA
More Detail: FLASH - NAND (MLC) Memory IC 64Gb (8G x 8) eMMC 40...
DataSheet: SFEM008GB1EA1TO-I-GE-111-STD datasheetSFEM008GB1EA1TO-I-GE-111-STD Datasheet/PDF
Quantity: 295
1 +: $ 12.51180
Stock 295Can Ship Immediately
$ 13.77
Specifications
Series: EM-20
Packaging: Tray 
Part Status: Active
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NAND (MLC)
Memory Size: 64Gb (8G x 8)
Clock Frequency: 400MHz
Write Cycle Time - Word, Page: --
Memory Interface: eMMC
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 153-LFBGA
Supplier Device Package: 153-LFBGA (11.5x13)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory plays a critical role in the operation of almost any modern computing device. It is used to store data and instructions that can be retrieved quickly and executed. The process of retrieving and executing instructions stored in memory is known as memory addressing. One type of memory device is the SFEM008GB1EA1TO-I-GE-111-STD.

The SFEM008GB1EA1TO-I-GE-111-STD is a flash memory module that was designed for industrial applications. It is capable of addressing up to 72 kilobytes of memory and providing data transfer rates up to 2 megabytes per second. Its robust design allows it to withstand extreme temperatures, electrical surges and other environmental hazards. The SFEM008GB1EA1TO-I-GE-111-STD also offers high reliability, ensuring reliable performance in a variety of industrial settings.

The SFEM008GB1EA1TO-I-GE-111-STD is designed with a number of features that make it ideal for industrial applications. The device is designed to operate in temperatures ranging from -40 to 100 degrees Celsius. It is also capable of sustaining stress levels up to 25 G’s and is fabricated using advanced fabrication technologies such as low-k dielectrics, QFN packaging and TSV routing. The device is designed to operate in a variety of conditions, making it an ideal choice for industrial applications.

The working principle of the SFEM008GB1EA1TO-I-GE-111-STD is based on its unique physical design. The device is constructed from multiple layers of silicon wafers. Each layer consists of a single-layer of memory cells arranged in a grid pattern. Each cell is connected to a separate I/O line and has a unique address. When a signal is passed through the memory, the electronic signals move through the memory cells and are routed to the appropriate I/O line. This allows for the simultaneous access of multiple cells and achieves high speed data transfers.

Another feature of the SFEM008GB1EA1TO-I-GE-111-STD is its ability to perform wear-leveling operations. This ensures that the memory module can be used in environments where there is a high level of wear and tear on the device. The wear-leveling operation helps to extend the life of the memory module by balancing the usage of each cell and reducing the risk of failure due to excessive wear. This feature makes the SFEM008GB1EA1TO-I-GE-111-STD an ideal choice for use in industrial applications.

The SFEM008GB1EA1TO-I-GE-111-STD is suitable for use in a variety of industrial markets. The device is resistant to shocks, vibrations, high electrical surges and extreme temperatures. It is also capable of achieving high transfer speeds and provides a robust data protection system. These features make the SFEM008GB1EA1TO-I-GE-111-STD an ideal choice for industrial applications.

The specific data is subject to PDF, and the above content is for reference

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