
Allicdata Part #: | SI32266-C-GM1-ND |
Manufacturer Part#: |
SI32266-C-GM1 |
Price: | $ 3.92 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Silicon Labs |
Short Description: | IC PROSLIC FXS DUAL -110V 50QFN |
More Detail: | Telecom IC Subscriber Line Interface Concept (SLIC... |
DataSheet: | ![]() |
Quantity: | 1000 |
480 +: | $ 3.56220 |
Series: | ProSLIC® |
Packaging: | Tray |
Part Status: | Active |
Function: | Subscriber Line Interface Concept (SLIC), CODEC |
Interface: | GCI, PCM, SPI |
Number of Circuits: | 1 |
Voltage - Supply: | 3.3V |
Current - Supply: | -- |
Operating Temperature: | -- |
Mounting Type: | Surface Mount |
Package / Case: | -- |
Supplier Device Package: | 50-QFN (6x8) |
Includes: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
SI32266-C-GM is an interface chip for uni-directional and bi-directional communication in Telecommunications systems. It is a high-performance single-chip solution that provides a flexible solution for both data and voice applications. The chip provides a variety of solutions for telecom applications, including LAN-to-LAN communication, VoIP, DSL, and other high-speed data communications.
The SI32266-C-GM is designed to provide the latest technology in digital signal processing to enable the most efficient transmission, reception, and control of digital information. The chip\'s built-in modem provides an efficient, optimized, and reliable way to transmit and receive data over a variety of communication media. It also provides an efficient, secure, and error-free communication path for voice applications.
The SI32266-C-GM is also highly reliable and flexible. It can be used in a variety of different network architectures such as Ethernet, ATM, and FDDI. It also supports multiple communications protocols such as IP, TCP, UDP, and others. The chip contains advanced error-detection, correction, and flow-control algorithms that enable the chip to adjust to network conditions quickly. This ensures that data is transmitted and received reliably.
The SI32266-C-GM is also integrated with a data-rate control module. This module enables the chip to automatically adjust its speed to accommodate different line conditions and data rates. This allows the chip to be used in a variety of different applications requiring different data-rates. For example, the chip can be used in VoIP applications, where different line conditions and data rates are required for efficient communication.
The SI32266-C-GM also includes a low-latency modem for voice and data applications. This modem is designed to provide higher performance, lower latency and improved security. The modem is also optimized for reliability and performance in different transmission media such as metal, glass, and plastic cables. This ensures that data is transmitted and received successfully and the latencies of voice and data applications are kept to a minimum.
In addition to its many features, the SI32266-C-GM is highly integrated with a wide range of communication peripherals, allowing it to integrate into existing communication infrastructures. The chip also supports multiple languages and is able to execute user-defined code to provide customers with even more customization options. This allows the chip to be used in a variety of different applications and provides a flexible solution for numerous telecom applications.
In summary, the SI32266-C-GM is an advanced interface chip for uni-directional and bi-directional communication in Telecommunications systems. The chip provides a flexible solution for a variety of applications, including LAN-to-LAN communication, VoIP, DSL, and other high-speed data communications. The chip is highly integrated with a wide range of communication peripherals, allowing it to integrate into existing infrastructures. The chip also supports multiple languages and is able to execute user-defined code to provide customers with even more customization options. Finally, the SI32266-C-GM is designed to provide the latest technology in digital signal processing to enable the most efficient transmission, reception, and control of digital information.
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