SIP1X03-011BLF Allicdata Electronics
Allicdata Part #:

SIP1X03-011BLF-ND

Manufacturer Part#:

SIP1X03-011BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 3POS GOLD
More Detail: N/A
DataSheet: SIP1X03-011BLF datasheetSIP1X03-011BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 3 (1 x 3)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

SIP1X03-011BLF is a type of socket for ICs, transistors, and integrated circuits. It is soldered onto the printed circuit board (PCB), providing an electrical connection between the two components. The socket also serves to protect the components from short circuits and other electrical damage. It is a reliable method to increase the reliability of the design.

The SIP1X03-011BLF application field consists of industrial, automotive, communication, telecom and other applications. It is designed to be compatible with all standard IC devices and features a maximum current rating of 9.5 amps. It is also flame retardant and is RoHS compliant. The SIP1X03-011BLF has a temperature range of -40°C to +100°C.

The working principle of the SIP1X03-011BLF is achieved by using the pin-and-socket configuration. It provides a firm electrical and mechanical connection between the two components. The socket has contacts on the inner and outer surfaces, which securely attach to the pins of the integrated circuit. This design also creates a secure mechanical connection that prevents shorts and maintains optimal functionality.

The SIP1X03-011BLF is designed for easy insertion and removal of the integrated circuit. It also has a strain relief feature which helps protect against physical damage. Additionally, the socket is designed with a durable and reliable construction that ensures long-term reliability. This socket is designed to withstand temperature extremes, shock, vibration and corrosion.

The SIP1X03-011BLF is designed to fit a wide variety of integrated circuits including small-outline integrated circuits (SOICs), thin small-outline packages (TSOPs), quad flat packages (QFPSs), transistor outline packages (TOPs) and extreme low-profile integrated circuits (ELPs). It can also be used to connect a variety of devices such as switching power supplies, solid state relays, motor starters, and current sensors. This socket is designed to meet the requirements of demanding application fields.

The SIP1X03-011BLF is an economical option for secure electrical connection between ICs and transistors. It is a reliable and durable product that is designed to withstand the rigors of harsh environments. It is easy to install and provides a secure mechanical connection that prevents shorts and maintains optimal functionality. This socket is designed to fit a wide variety of integrated circuits and is ideal for industrial, automotive, communication, telecom and other applications.

The specific data is subject to PDF, and the above content is for reference

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