SIP1X27-014BLF Allicdata Electronics
Allicdata Part #:

SIP1X27-014BLF-ND

Manufacturer Part#:

SIP1X27-014BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 27POS TIN
More Detail: N/A
DataSheet: SIP1X27-014BLF datasheetSIP1X27-014BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 27 (1 x 27)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The SIP1X27-014BLF is an integrated circuit socket designed for use with standard-sized integrated circuits (ICs), transistors, and other semiconductor packages. It is an ideal solution for IC- , transistor-, and semiconductor-based applications that require reliable and efficient electrical connection to target devices.

The product is designed with a highly reliable contact spring that ensures reliable engagement between contact leads and applications. It has an enhanced field-replaceable contact pin structure that enables easy replacement of damaged pins or leads, resulting in reduced maintenance costs. Additionally, the SIP1X27-014BLF also features a low-profile design that simplifies installation and increases the application\'s portability. Furthermore, it offers superior protection from static electricity and is protected against dust, lint, and other contaminants.

One of the main advantages of the SIP1X27-014BLF is its wide range of applications. It can be used in a variety of consumer electronics, automotive, telecommunications, medical, and industrial applications. The product offers support for a wide range of integrated circuits, including microcontrollers, switching transistors, SCRs, thyristors, and voltage regulators. Furthermore, it is compatible with ICs and transistors of all popular sizes, making it an ideal choice for applications with multiple chip types.

The working principle of the SIP1X27-014BLF is quite simple. The device consists of two parts: a base system and a contact spring. The base system consists of a plastic base, contact pins, and metal contact springs. The contact springs provide electrical connection between the base system and the contact pins of the target device. When the contact pins of the target device are inserted into the socket, the metal contact springs are compressed, providing a reliable connection between the ICs and transistors.

The SIP1X27-014BLF is designed and manufactured with the highest quality and reliability standards. It has been extensively tested in a variety of laboratory environments to ensure its compliance with international standards. Furthermore, the product has been developed to offer superior performance and durability, making it a great option for a wide range of application needs.

In conclusion, the SIP1X27-014BLF is a versatile and reliable integrated circuit socket designed to support a variety of ICs, transistors, and other semiconductor packages. It offers enhanced field-replaceable contact pin structure, superior protection from static electricity, and a low-profile design, making it perfect solutions for various applications. Additionally, it is designed and manufactured with the highest quality and reliability standards, making it an ideal option for consumer electronics, automotive, telecommunications, medical, and industrial applications.

The specific data is subject to PDF, and the above content is for reference

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