SIP1X05-041BLF Allicdata Electronics
Allicdata Part #:

SIP1X05-041BLF-ND

Manufacturer Part#:

SIP1X05-041BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 5POS GOLD
More Detail: N/A
DataSheet: SIP1X05-041BLF datasheetSIP1X05-041BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 5 (1 x 5)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

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Sockets for ICs, Transistors

SIP1X05-041BLF is a socket for ICs and transistors, which is created for the purpose of heat dissipation. The socket is mainly used in the electrical and electronic engineering fields. It is typically used in high voltage power applications where it is necessary to dissipate heat.

Application

This IC socket is commonly used in commercial products ranging from power amplifiers, electronic ballasts, switch mode power supplies and rectifiers. It can also be used in automotive and home applications as well. The socket is particularly useful for applications where the device needs to be cooled quickly and efficiently.

Working principle

The working principle of SIP1X05-041BLF is simple. The socket is designed to accept ICs or transistors that need to be separated from their heat sinks. The socket has a series of pins that contact the ICs or transistors. As the pins contact the device, heat is transferred away from the device and towards the pins. The heat is then dissipated into the air or through a heat sink.

The socket also contains a thermal pad, which ensures that the device will be thermally efficient. The thermal pad also protects the device from shorts or exposure to extreme temperatures.

The socket also has a variety of features such as multiple mating points, over-temperature protection, and an auto-reset feature. This socket is very reliable and it is designed to last for a long time. It is also very easy to install and use.

Conclusion

In conclusion, SIP1X05-041BLF is a great socket for ICs and transistors. It is very reliable and easy to install and use. This socket is ideal for applications where the device needs to be cooled quickly and efficiently. The socket also contains a thermal pad, which ensures that the device will be thermally efficient.

The specific data is subject to PDF, and the above content is for reference

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