SIP1X12-011BLF Allicdata Electronics
Allicdata Part #:

SIP1X12-011BLF-ND

Manufacturer Part#:

SIP1X12-011BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 12POS GOLD
More Detail: N/A
DataSheet: SIP1X12-011BLF datasheetSIP1X12-011BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 12 (1 x 12)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

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Sockets for ICs and transistors are essential components for electronic projects and are used in many different applications. The SIP1X12-011BLF is a special socket designed for small integrated circuits (ICs) and transistors, making it an ideal choice for prototype and experimental projects. In this article, we will discuss the application field and working principle of the SIP1X12-011BLF.

The SIP1X12-011BLF is a surface-mount socket for small ICs and transistors. It is designed with a twelve-pin configuration and a total length of around 1.23 inches (3.1 cm).

This socket is typically used in applications where space is at a premium. It is also useful for creating a prototype circuit board before moving on to a larger, more permanent configuration. The socket can be soldered directly onto a PCB for a highly stable connection, or used in conjunction with a prototyping breadboard for more flexibility.

The SIP1X12-011BLF is designed with a dual-beam spring design. This design ensures that components are securely held in place and connected to the socket with reliable electrical contact. The socket is constructed from high-grade materials and designed to be highly durable and reliable. It is also designed to have excellent electrical properties, allowing it to handle higher frequencies and power levels.

The SIP1X12-011BLF can be used in a variety of applications, including audio amplifiers, power supplies, analog circuits, test and measurement, radio and digital transmission, and robotics. It can be used to connect to a wide range of components, including diodes, capacitors, resistors, transistors, and microcontrollers.

In addition to its application field, this socket is also designed with a number of safety features. It complies with Underwriters Laboratories (UL) standards for safety, reliability, and performance. The socket is also designed with special insulating materials that protect against shock or heat damage. It also has an epoxy-fill to protect against environmental contamination.

The SIP1X12-011BLF is a reliable and versatile socket for ICs and transistors. Its dual-beam spring design ensures reliable electrical contact and its special safety features make it ideal for applications where safety and reliability are critical. Its small size also makes it a great choice for tight spaces, and its ease of use makes it a great option for prototyping.

The specific data is subject to PDF, and the above content is for reference

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