SIP1X06-001BLF

Features:	Closed Frame
Contact Resistance:	--
Material Flammability Rating:	UL94 V-0
Termination Post Length:	0.125" (3.18mm)
Operating Temperature:	--
Housing Material:	Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post:	Brass
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Finish - Post:	Tin
Pitch - Post:	0.100" (2.54mm)
Termination:	Solder
Series:	SIP1x
Mounting Type:	Through Hole
Contact Material - Mating:	Beryllium Copper
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	6 (1 x 6)
Type:	SIP
Part Status:	Obsolete
Packaging:	Bulk

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Sockets for ICs, Transistors

The SIP1X06-001BLF is a 3-pin socket for integrated circuits (ICs) and transistors. This socket is electrically compatible with a variety of pinouts, including those of the P and F ranges of IC\'s and transistors. It is designed for use in high-volume, low-cost production with efficient automatic insertion capabilities. The socket is made of high-grade Nylon 6/6 material and is plastic blow molded.

Application Field

The SIP1X06-001BLF is suitable for automated assembly in a broad variety of electronic devices, including cell phones, household appliances, medical devices, educational equipment, computers, consumer electronics, automotive electronics, industrial control, audio and video equipment, and power supplies. The socket is suitable for IC2425/DIP24/SSOP24 packages and is available in multiple pitch sizes, from 0.8mm to 3.60mm. Its high contact reliability and low insertion force-through-hole pins make this socket an ideal choice for automated production lines.

Working Principle

The SIP1X06-001BLF socket works by providing a secure electrical connection between the IC and the socket. The socket is designed to hold a standard IC with three pins. It also has a tab on the bottom that secures the IC into the socket and prevents it from being removed. The socket has four contact points on the sides and the bottom of the socket which make contact with the pins of the IC. The contact points are spring-loaded, ensuring a secure electrical connection with the IC pins and also allowing the socket to be released with minimal effort. The socket is designed to ensure that the IC is locked into the socket and can only be removed by an outside force, preventing loosening of the connection during operation. The socket is also designed to prevent damage caused during insertion or removal, ensuring a reliable connection throughout the life of the device. The SIP1X06-001BLF socket is a cost-effective solution for automated production lines and is suitable for use with a variety of packages, from low-density to high-density integrated circuits. It is also an ideal solution for applications requiring a low insertion force and reliable contact points. This socket is robust and resistant to shock and vibration, ensuring reliable operation over the long-term.

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