SMG236354R-0.315 Allicdata Electronics

SMG236354R-0.315 RF/IF and RFID

Allicdata Part #:

1798-1291-2-ND

Manufacturer Part#:

SMG236354R-0.315

Price: $ 0.40
Product Category:

RF/IF and RFID

Manufacturer: Leader Tech Inc.
Short Description: SURFACE MOUNT GASKET
More Detail: N/A
DataSheet: SMG236354R-0.315 datasheetSMG236354R-0.315 Datasheet/PDF
Quantity: 600
600 +: $ 0.35910
1200 +: $ 0.28350
3000 +: $ 0.26460
6000 +: $ 0.25137
15000 +: $ 0.24192
Stock 600Can Ship Immediately
$ 0.4
Specifications
Series: --
Part Status: Active
Type: Film Over Foam
Shape: Rectangle
Width: 0.354" (9.00mm)
Length: 0.315" (8.00mm)
Height: 0.236" (6.00mm)
Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating: --
Plating - Thickness: --
Attachment Method: --
Operating Temperature: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The SMG236354R-0.315 Contact Fingerstock and Gasket is a great electrical option for projects that require low-profile, reliable protection from RFI and EMI interference. Its unique design utilizes a combination of conductive strips and steel to provide a high performance electric connection between two mating surfaces while providing reliable and consistent EMI shielding. This fingerstock and gasket is designed for environments with high levels of electromagnetic interference, and is great for use in aerospace, military, and medical applications.

Application Field

This contact, fingerstock and gasket is ideal for use in a variety of applications including, but not limited to, electronic packages, military armored vehicles, computer and power supply enclosures, racks and cabinets, and other applications requiring low-profile electrically conductive shields.

Working Principle

When properly installed, the contact fingerstock and gasket form an effective shield against both RFI and EMI interference which can otherwise affect the performance of sensitive electronic components. Its unique design utilizes a combination of a conductive strip and a steel or non-metallic material, with an electrically isolated contact pad located between the conductive strip and materials. This design ensures that when properly installed, any EMI received by the contact fingerstock and gasket will be dispersed over the cross-sectional area of the contact pad. Additionally, due to its low profile, the contact fingerstock and gasket can be easily mounted onto assembly boards and helps minimize space requirements for installing the assembly board.

In order to achieve the optimal protection against RFI and EMI interference, it is recommended that the contact fingerstock and gasket be installed in such a way as to completely cover the mating surfaces. A combination of contact screws, tabs, and press fit together with a correctly designed die can be used to secure the contact fingerstock and gasket firmly onto the assembly board. For the best results, the contact screw should be firmly tightened against the contact pad and flush with the surface of the gasket, while ensuring that the contact pad maintained good electrical contact with the mating surface.

In order to maximize the EMI shielding performance of the contact fingerstock and gasket, it is recommended that they be installed in accordance with any relevant EMI guidelines and standards. Additionally, proper inspection, testing, and verification of the installation should also be performed in order to ensure that it meets the desired application specifications.

The SMG236354R-0.315 Contact Fingerstock and Gasket is an excellent option for projects which require low-profile, reliable protection from RFI and EMI interference. Its unique design utilizes a combination of conductive strips and steel to provide a high performance electric connection between two mating surfaces while providing reliable and consistent EMI shielding. Its low-profile design makes it ideal for use in a variety of applications requiring EMI shielding, and its flexible installation methods allow it to be easily mounted onto assembly boards for maximum performance.

The specific data is subject to PDF, and the above content is for reference

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