| Allicdata Part #: | 1168-2136-ND |
| Manufacturer Part#: |
TG-CJ-20-20-6-PF |
| Price: | $ 0.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | t-Global Technology |
| Short Description: | HEATSINK CER 20X20X6MM |
| More Detail: | Heat Sink Ceramic Heat Spreader |
| DataSheet: |  TG-CJ-20-20-6-PF Datasheet/PDF |
| Quantity: | 472 |
| 1 +: | $ 0.63000 |
| 10 +: | $ 0.60291 |
| 25 +: | $ 0.57254 |
| 50 +: | $ 0.55755 |
| 100 +: | $ 0.55005 |
| 250 +: | $ 0.51237 |
| 500 +: | $ 0.48223 |
| 1000 +: | $ 0.43702 |
| 5000 +: | $ 0.42195 |
| Series: | -- |
| Part Status: | Active |
| Type: | Heat Spreader |
| Package Cooled: | -- |
| Attachment Method: | -- |
| Shape: | Square, Fins |
| Length: | 0.787" (20.00mm) |
| Width: | 0.787" (20.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Ceramic |
| Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are used in many different applications, from cooling electronic components in computers, to controlling temperatures in industrial and medical equipment. The TG-CJ-20-20-6-PF thermal heat sink is a component specifically designed to dissipate heat from other components, while providing maximum heat protection and performance. In this article, we will examine the application field and working principle of the TG-CJ-20-20-6-PF thermal heat sink.
The TG-CJ-20-20-6-PF thermal heat sink is designed for applications where high temperatures and forced convection are needed for optimal heat transfer. It is an extrusion heat sink designed for high performance cooling of electronic devices. This heat sink can be used to dissipate heat from a variety of components including CPUs, GPUs, FPGAs, and memory modules. This heat sink is also suitable for cooling high power resistors, diode bridges, and a range of power supplies.
The TG-CJ-20-20-6-PF thermal heat sink is composed of an extruded aluminum body with finned surfaces. This design allows the heat generated by the component to be quickly transferred to the heat sink fins, where it is dissipated into the surrounding environment. The heat sink also includes a separate fan for additional cooling, which can be connected to the motherboard for power. This fan helps to provide an efficient and effective cooling system.
The working principle of the TG-CJ-20-20-6-PF thermal heat sink is based on forced convection. Convection is the transfer of energy from a component to its environment via the transfer of heat. By using a fan to force air over the heat sink, the internal fan ensures that the heat dissipation process is efficient and that the component will remain cool. The fan also helps to increase the overall cooling capability of the system. The design of the heat sink also ensures that the air can circulate freely over the fins, allowing the maximum amount of heat to dissipate.
The TG-CJ-20-20-6-PF thermal heat sink is a versatile and efficient cooling component that is suitable for a wide range of applications. Its design allows the component to dissipate heat quickly and efficiently, while providing maximum heat protection and performance. In addition, its fan ensures that the convective heat transfer process is efficient and that the component will remain cool. This makes the TG-CJ-20-20-6-PF thermal heat sink an ideal choice for applications that require high performance cooling.
The specific data is subject to PDF, and the above content is for reference