| Allicdata Part #: | 1168-2137-ND |
| Manufacturer Part#: |
TG-CJ-30.5-30.5-6-PF |
| Price: | $ 0.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | t-Global Technology |
| Short Description: | HEATSINK CER 30.5X30.5X6MM |
| More Detail: | Heat Sink Ceramic Heat Spreader |
| DataSheet: |  TG-CJ-30.5-30.5-6-PF Datasheet/PDF |
| Quantity: | 11 |
| 1 +: | $ 0.87570 |
| 10 +: | $ 0.83412 |
| 25 +: | $ 0.81220 |
| 50 +: | $ 0.79015 |
| 100 +: | $ 0.74630 |
| 250 +: | $ 0.70237 |
| 500 +: | $ 0.65848 |
| 1000 +: | $ 0.61458 |
| 5000 +: | $ 0.59263 |
| Series: | -- |
| Part Status: | Active |
| Type: | Heat Spreader |
| Package Cooled: | -- |
| Attachment Method: | -- |
| Shape: | Square, Fins |
| Length: | 1.201" (30.50mm) |
| Width: | 1.201" (30.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Ceramic |
| Material Finish: | -- |
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Thermal management is an important component of many electrical systems. Heat sinks are designed to absorbs heat, dissipate it, remove it, or transfer it away from vital electronic components. TG-CJ-30.5-30.5-6-PF is a type of heat sink used to improve thermal management in electrical systems.
The TG-CJ-30.5-30.5-6-PF is a rectangular heat sink with dimensions of 30.5x30.5x6mm. Its small size and low profile make it ideal for use in confined spaces. The material used to construct the TG-CJ-30.5-30.5-6-PF is aluminum, which provides it with excellent efficiencies in heat dissipation. The aluminum is available in two different finishes: black or natural. The TG-CJ-30.5-30.5-6-PF also has several mounting possibilities, depending on the application.
The TG-CJ-30.5-30.5-6-PF has several applications. It can be used to effectively remove heat from electronic components such as circuit boards or power modules that generate excessive heat due to high power dissipation. The TG-CJ-30.5-30.5-6-PF is also used to increase airflow and increase heat transfer efficiency in some applications.
The working principle of the TG-CJ-30.5-30.5-6-PF is based on natural convection. This occurs when a cooling medium, such as air, is in contact with a warm surface and is heated. The heat transfer from the warm surface to the cooling medium produces a flow of air or liquid that carries the heat away from the warm surface. The TG-CJ-30.5-30.5-6-PF utilizes this principle in order to transfer heat away from electronic components and components’ packages.
In order to maximize the performance of the TG-CJ-30.5-30.5-6-PF, it is important to make sure that proper airflow is established. This is done by using an air mover, such as a fan, blower, or air duct, to create an airflow across the heat sink. When air is moved across the heat sink, it absorbs heat from the surface of the heat sink and carries it away. This sets up a cycle of air flowing across the heat sink, which absorbs heat and carries it away at an accelerated rate. The increased air movement over the surface of the heat sink increases its efficiency in heat transfer.
In conclusion, the TG-CJ-30.5-30.5-6-PF is a small and low-profile heat sink that is designed to effectively remove heat from electronic components. It utilizes natural convection to draw heat away from the components and dissipate it into the surrounding air. The thermal performance of the TG-CJ-30.5-30.5-6-PF can be maximized by making sure that proper air flow is established across its surface. This ensures that the heat is effectively removed from the components and transferred away from them.
The specific data is subject to PDF, and the above content is for reference