| Allicdata Part #: | 1168-2130-ND |
| Manufacturer Part#: |
TG-CJ-LI-20-20-6-PF |
| Price: | $ 0.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | t-Global Technology |
| Short Description: | HEATSINK CER 20X20X6MM W/TAPE |
| More Detail: | Heat Sink Ceramic Heat Spreader |
| DataSheet: |  TG-CJ-LI-20-20-6-PF Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 0.80010 |
| 10 +: | $ 0.75915 |
| 25 +: | $ 0.73937 |
| 50 +: | $ 0.71946 |
| 100 +: | $ 0.67946 |
| 250 +: | $ 0.63948 |
| 500 +: | $ 0.59951 |
| 1000 +: | $ 0.55954 |
| 5000 +: | $ 0.53956 |
| Series: | -- |
| Part Status: | Active |
| Type: | Heat Spreader |
| Package Cooled: | -- |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.787" (20.00mm) |
| Width: | 0.787" (20.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Ceramic |
| Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal solutions are an essential part of any computing environment. Heat sinks, for instance, are often used to keep machines running at optimal temperatures. The TG-CJ-LI-20-20-6-PF is a highly efficient heat sink designed to cool high-power thermal loads in larger telecom and datacenter systems.
The TG-CJ-LI-20-20-6-PF is constructed from a lightweight aluminum alloy with a thermal conductivity of over 400 W/mK. Its design features an advanced cooling approach which includes a micro-channel design and fins optimized to maximize airflow during operation. This ensures maximum heat transfer from processor to air, resulting in improved performance and lower operating temperatures.
Thermal management plays a critical role in any industrial system. The TG-CJ-LI-20-20-6-PF is designed to keep your equipment running at its optimal temperature, even under demanding workloads. With its high-quality aluminum alloy construction, robust mounting system, and advanced cooling approach, the TG-CJ-LI-20-20-6-PF is an ideal choice for large systems with high heat loads.
The TG-CJ-LI-20-20-6-PF is designed to work in both vertical and horizontal airflow arrangements. This allows for great flexibility when mounting the device in tight spaces. The device also features two 120 mm fan mounts positioned in the center of the heat sink to ensure proper cooling. The fan mounts can be used to attach additional cooling modules, such as water or therma-control radiators, if needed.
The TG-CJ-LI-20-20-6-PF is also designed to operate at peak efficiency in environments with high turbulence and air pressure. Its micro-channel fins are specially engineered to handle high-speed air flow, ensuring maximum efficiency and thermal performance. Additionally, the fins are designed to trap heat within the heat sink, resulting in more effective cooling.
The TG-CJ-LI-20-20-6-PF is an excellent choice for keeping high-powered thermal loads at optimal temperatures. With its lightweight design, highly efficient cooling approach, and flexible mounting options, it’s an ideal solution for large-scale computing or telecom systems. Whether you’re looking for a simple, low-cost solution or a robust, high-performance solution, the TG-CJ-LI-20-20-6-PF is the perfect choice.
The specific data is subject to PDF, and the above content is for reference