TG-CJ-LI-30.5-30.5-6-PF Allicdata Electronics
Allicdata Part #:

1168-2131-ND

Manufacturer Part#:

TG-CJ-LI-30.5-30.5-6-PF

Price: $ 1.48
Product Category:

Fans, Thermal Management

Manufacturer: t-Global Technology
Short Description: HEATSINK CER 30.5X30.5X6MM W/TAP
More Detail: Heat Sink Ceramic Heat Spreader
DataSheet: TG-CJ-LI-30.5-30.5-6-PF datasheetTG-CJ-LI-30.5-30.5-6-PF Datasheet/PDF
Quantity: 436
1 +: $ 1.34190
10 +: $ 1.30914
25 +: $ 1.27361
50 +: $ 1.20292
100 +: $ 1.13217
250 +: $ 1.06142
500 +: $ 1.02605
1000 +: $ 0.91990
5000 +: $ 0.90221
Stock 436Can Ship Immediately
$ 1.48
Specifications
Series: --
Part Status: Active
Type: Heat Spreader
Package Cooled: --
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 1.201" (30.50mm)
Width: 1.201" (30.50mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Ceramic
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are important components for controlling the temperature of an electronic device and other types of equipment. The TG-CJ-LI-30.5-30.5-6-PF is a type of heat sink that has been designed with precise engineering to provide superior heat dissipation for electronic devices, improving their efficiency and performance. In this article, we’ll discuss the application field and working principle of the TG-CJ-LI-30.5-30.5-6-PF and how it fits into the Thermal - Heat Sinks category.
The TG-CJ-LI-30.5-30.5-6-PF is designed for applications where space is limited and where thermal performance is paramount. It is suitable for mounting in tight spaces, providing superior heat transfer directly from the heat generating components of an electronic device. The TG-CJ-LI-30.5-30.5-6-PF is designed to be low profile and is specifically designed for a wide variety of applications, such as small consumer electronics and even within medical imaging equipment.
The TG-CJ-LI-30.5-30.5-6-PF utilizes a sophisticated combinational die-casting process involving aluminum as its main material. This process, combined with a special fin structure, is able to dissipate heat quickly and efficiently. The heatsink also features a black anodized finish, which prevents oxidation and stainless steel screws that securely attach the heatsink to the heat-generating component.
The main working principle of the TG-CJ-LI-30.5-30.5-6-PF is to transfer heat away from the source component and then dissipate it into the surrounding environment. This is done by cooling the source component with a fan or other cooling device and then passing the air through the fins of the heatsink. The fins are structured in such a way that the air is forced to follow a specific path, dissipating the heat as it moves along. The die-cast aluminum body of the heatsink helps to further dissipate the heat, increasing efficiency and performance.
The TG-CJ-LI-30.5-30.5-6-PF is a perfect example of how Thermal - Heat Sinks can help to provide efficient heat dissipation and improved performance of electronic devices. By creating an efficient heat transfer and dissipation path, the TG-CJ-LI-30.5-30.5-6-PF can help to prevent any electronics from overheating, guaranteeing their optimal performance and longevity.

The specific data is subject to PDF, and the above content is for reference

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