| Allicdata Part #: | 1168-2134-ND |
| Manufacturer Part#: |
TG-CJ-LI-60-60-15-PF |
| Price: | $ 5.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | t-Global Technology |
| Short Description: | HEATSINK CER 60X60X15MM W/TAPE |
| More Detail: | Heat Sink Ceramic Heat Spreader |
| DataSheet: |  TG-CJ-LI-60-60-15-PF Datasheet/PDF |
| Quantity: | 25 |
| 1 +: | $ 4.98330 |
| 10 +: | $ 4.84722 |
| 25 +: | $ 4.57783 |
| 50 +: | $ 4.30857 |
| 100 +: | $ 4.03931 |
| 250 +: | $ 3.77002 |
| 500 +: | $ 3.50074 |
| 1000 +: | $ 3.43341 |
| Series: | -- |
| Part Status: | Active |
| Type: | Heat Spreader |
| Package Cooled: | -- |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Ceramic |
| Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become an increasingly important consideration for modern processors and other advanced semiconductor devices. Heat sinks are used to dissipate heat from a component or device, which makes them an important thermal management tool. A popular type of heat sink is the TG-CJ-LI-60-60-15-PF. This heat sink has a wide range of applications and uses a unique working principle to increase efficiency.
One of the most common applications of the TG-CJ-LI-60-60-15-PF heat sink is in electronic engineering. It is commonly used to keep stabilized high-frequency electric circuit components and integrated circuits cool during operation. This heat sink is particularly well-suited for cooling sensitive components such as memory modules, microprocessors, and other complex electronic devices. It is also often used in military and aerospace applications, as it helps keep components cool and reliable in hot or extreme environments.
Another important application of the TG-CJ-LI-60-60-15-PF heat sink is in the manufacturing of printed circuit boards (PCBs). It is often used to mount components securely on the board and to provide a stable, efficient cooling system for components that generate a high amount of heat, such as power amplifiers, Field Programmable Gate Arrays (FPGAs), and many other devices. The heat sink is also used for high-power transistors and other devices that may become damaged from heat when running at high voltages.
The TG-CJ-LI-60-60-15-PF heat sink utilizes a unique working principle to deliver efficient cooling. It features multiple heat pipes, which maximize output thermal power dissipation. The heat pipes are composed of two heat-conducting halves that are connected through metal pins. These pins create a vacuum seal which eliminates any air gaps and become filled with a liquid that quickly absorbs and dissipates heat away from the component. This ensures maximum cooling efficiency and prolongs the life of the component.
In order to optimize heat dissipation, the TG-CJ-LI-60-60-15-PF heat sink utilizes a combination of three types of fans – ball bearing fans, muffle fans, and silent fans. Each fan type provides varying levels of air flow and noise levels, allowing designers to customize the right amount of cooling for their specific needs. Additionally, the fans are encased in aluminum caps, which prevent dust from entering the heat sink.
The TG-CJ-LI-60-60-15-PF heat sink has a wide range of applications and is an incredibly efficient thermal management tool. Its combination of heat pipes and multiple fan types allow it to provide optimal cooling in a variety of environments, making it an ideal heat sink for electronic engineering, manufacturing of printed circuit boards, military applications, and other uses.
The specific data is subject to PDF, and the above content is for reference