TMOV14RP460EL2T7

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Part Status:	Active

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                                TMO14RP460EL2T7 APPLICATION FIELD AND WORKING PRINCIPLE

TMOV14RP460EL2T7 is a type of voltage-controlled potting material designed to provide favorable electronic conduction and insulation properties while offering excellent protection from mechanical damage, dust, moisture and fluid ingression.The major application for TMOV14RP460EL2T7 is to provide electrical insulation and protection for components and assemblies exposed to harsh environments and operating temperatures. It is mainly used for potting and encapsulation of surface mount components, as well as for protected cable and wire termination.TMO14RP460EL2T7 is manufactured from specific thermoplastic and fillers that when combined, allow it to undergo controlled thermal expansion as well as ensuring adequate flowability for efficient potting and encapsulation.At the heart of TMO14RP460EL2T7 is its working principle. The thermoplastic matrix acts as a conductor, allowing electrons and ions to travel through it. The fillers create one or more additional pathways, increasing the electrical conduction properties of the mixture. However, the fillers also add thermal resistance, preventing heat transfer to and from the matrix, protecting sensitive components and circuitry form damage in the long run.The chemical characteristics also give TMO14RP460EL2T7 an extra advantage when compared to other potting and encapsulation materials. With its superior resistance to water and other chemicals, it is ideal for outdoor, marine and/or extreme temperature applications.The combination of low electrical conduction and low thermal conduction allows TMO14RP460EL2T7 to perform in demanding environments and temperatures. The material does not conduct electricity until it reaches a certain temperature. Once it reaches this temperature, the electrons and ions to flow through the matrix, thus providing electrical conduction.At the same time, the low thermal conduction limits the amount of heat created and transferred through the matrix, so the components and circuit protected remain at the desired temperature for the duration of its operational cycle.To sum up, TMO14RP460EL2T7 provides reliable potting and encapsulation of sensitive electronics components and assemblies with superior electrical and thermal properties that make it well-suited for a variety of demanding environments and applications. It is extremely durable, and can stand up to even the harshest elements, providing superior protection and insulation. With its superior conductive and thermal resistance properties, TMO14RP460EL2T7 is the ultimate choice for potting and encapsulation of components exposed to extreme temperatures and environments.

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