| Allicdata Part #: | UP1-TO3B-ND |
| Manufacturer Part#: |
UP1-TO3B |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CTS Thermal Management Products |
| Short Description: | HEATSINK HORZ MNT BLACK TO-3 |
| More Detail: | Heat Sink TO-3 Aluminum Board Level |
| DataSheet: |  UP1-TO3B Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | -- |
| Part Status: | Obsolete |
| Type: | Board Level |
| Package Cooled: | TO-3 |
| Attachment Method: | Bolt On |
| Shape: | Square, Pin Fins |
| Length: | 1.780" (45.21mm) |
| Width: | 1.780" (45.21mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 10.40°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
When it comes to the thermal-heat sinks application field, the UP1-TO3B is a revoltionary and reliable product. Thermal-heat sinks allow the air and other flowing fluids to cool electronic and electrical components, effectively absorbing and quickly transferring the heat that is generated. This helps to prevent dangerous temperature situations that damage components. UP1-TO3B thermal-heat sinks are designed to optimize the performance of all types of electronic circuits and systems.
Thermal-heat sinks provide several benefits, including increased heat transfer rate, superior thermal conductivity, uniform cooling effect, improved system reliability, higher power outputs and longer life expectancy.
The UP1-TO3B\'s working principle is quite simple and straightforward. The primary components of a thermal-heat sink are a heat source (such as a junction circuit), a metal block, and fins. The metal block acts as a conductor that transfers the heat generated by the junction circuit to the fins. The fins then dissipate the heat into the surrounding air or other flowing fluid. The UP1-TO3B\'s fin design allows for optimal airflow and heat dissipation, resulting in maximum cooling efficiency and a longer life of the electronics.
The UP1-TO3B thermal-heat sink also has an integrated temperature sensor, which can detect any sudden increases in heat and quickly respond in order to maintain the system\'s safe operating temperature. The UP1-TO3B is also designed to maintain a uniform cooling effect over a large area, ensuring that all components experience the same amount of cooling.
The UP1-TO3B thermal-heat sink is suitable for use in a wide range of applications. It is commonly used in personal computers, desktop computers, communication equipment, automotive, aerospace, medical and industrial applications. The UP1-TO3B is also highly reliable and efficient for use in mission-critical applications where precise thermal management is essential for optimal performance.
The UP1-TO3B is a top-of-the-line product that provides excellent thermal performance and long-term reliability. Its design ensures maximum cooling efficiency and a wide range of applicability. It is also user-friendly and offers an easy installation process. All these features make the UP1-TO3B an ideal choice for thermal-heat sink applications.
The specific data is subject to PDF, and the above content is for reference