UTP28SP13

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UTP28SP13, also referred to as a Multi Layer rigid Solder Paste Dispensing, is a machine mainly used for small parts’ stenciling. It is mainly designed to provide quick, accurate, and precise solder paste dispense for different electronic components. UTP28SP13 is perfect for the applications that require high accuracy and speed, such as thin leads on an IC, narrow PCB panels, and chips with higher pin count. The impressive versatility of this machine which helps you to perform most production processes accurately and quickly.

The key element of UTP28SP13 is its optical registration system and the multi-layer conveyor. The optical registration system is three dimensional and its accuracy is very high which makes it perfect for multi-stage stenciling. The multi-layer conveyor allows it to be used with a large variety of lead counts, board sizes, and materials.

The UTP28SP13 also adopts a specialised variant of the dry film photolithography process which makes it suitable for very fine pitch production processes such as those required for the application of adhesives or coatings. The photolithography process works by dynamically projecting a light-emitting diode (LED) pattern onto the substrate which gives a high resolution and minimises the risk of splatter and other cross-contamination. This additive process of creating a stencil avoids contact between the printed board and the printer, dramatically reducing the risk of damaging or scratching the substrate.

UTP28SP13’s working principle is as follows. Firstly the substrate is loaded onto a conveyor which is driven by the electro-mechanical actuator. The substrate then passes through the optical registration system which accurately detects and orients the substrate in the desired orientation. As the substrate moves, solder paste is then dispensed from the spout of the nozzle onto the designated components. After the dispense the substrate passes through curing systems which fully hardens the solder paste, ensuring a robust connection between the components and the board.

In conclusion, UTP28SP13 is a highly advanced multi layer rigid solder paste dispensing machine that provides unparalleled performance in terms of accuracy and speed. Its robust optical registration system and multi-layer conveyor give it an impressive breadth of applications. Moreover, its photolithography process helps to avoid damaging or scratching the substrates. Overall, UTP28SP13 is a reliable and successful solution for many production related processes.

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