Allicdata Part #: | AE10775-ND |
Manufacturer Part#: |
V-1100-SMD/B-L |
Price: | $ 0.32 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEAT SINK ALUM DPAK TO-252 |
More Detail: | Heat Sink TO-252 (DPak) Copper Top Mount |
DataSheet: | V-1100-SMD/B-L Datasheet/PDF |
Quantity: | 5732 |
1 +: | $ 0.28980 |
10 +: | $ 0.27720 |
25 +: | $ 0.26334 |
50 +: | $ 0.25641 |
100 +: | $ 0.25295 |
250 +: | $ 0.23562 |
500 +: | $ 0.22176 |
1000 +: | $ 0.20097 |
5000 +: | $ 0.19404 |
Specifications
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-252 (DPak) |
Attachment Method: | SMD Pad |
Shape: | Rectangular, Fins |
Length: | 0.320" (8.13mm) |
Width: | 0.790" (20.07mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.390" (9.91mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 25.00°C/W |
Material: | Copper |
Material Finish: | Tin |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are thermal management solutions used to maximize the efficiency of electronic components. The V-1100-SMD/B-L is often used in these applications. Its working principle is based on the principle of convective heat transfer.The V-1100-SMD/B-L is a thermal heat sink that utilizes the process of convective heat transfer to move heat away from components. Heat is transferred through the air to the heat sink, allowing components to remain cool and operate safely. This type of heat sink has an increased heat transfer rate when compared to other types of thermal management solutions.The V-1100-SMD/B-L is used in a variety of applications, such as laser diode modules, gas sensing modules, and LED modules. It features a low profile design, which allows it to fit into small spaces where other heat sinks may not be able to. It also contains two mounting holes for easy installation and a slot for a thermal pad.It is important to note that the V-1100-SMD/B-L is designed to dissipate heat from components in order to protect them from overheating and damage. Each thermal management solution should be matched with the components’ power ratings and specific thermal projected needs. With the correct combination of materials, components can maintain a steady operating temperature, which helps to reduce power consumption and extend component lifetime.Because of its low profile design and ability to dissipate heat effectively, the V-1100-SMD/B-L can be used in applications where other designs may be too large or inefficient. This type of thermal management solution is commonly used to manage thermally-sensitive components, such as lasers, in industrial and commercial applications.The V-1100-SMD/B-L is also versatile enough to be used in a variety of other applications, such as cooling down high performance processors, providing orderly thermal dissipation for heat sensitive devices, and providing reliable thermal regulation in portable electronics. This heat sink is a popular choice for applications requiring both a low profile and excellent thermal performance.The V-1100-SMD/B-L is an excellent thermal management solution for a variety of applications. Its low profile design allows it to fit into small spaces, while its excellent thermal performance ensures that components stay cool and operate efficiently. When selecting a heat sink, it is important to consider the power ratings and projected thermal needs of the components to be cooled. By doing this, components can be protected from overheating and have extended useful lifespans.
The specific data is subject to PDF, and the above content is for reference
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