V-1100-SMD/B Fans, Thermal Management |
|
Allicdata Part #: | AE10774TR-ND |
Manufacturer Part#: |
V-1100-SMD/B |
Price: | $ 0.39 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEAT SINK ALUM DPAK TO-252 |
More Detail: | Heat Sink TO-252 (DPak) Copper Top Mount |
DataSheet: | V-1100-SMD/B Datasheet/PDF |
Quantity: | 15600 |
400 +: | $ 0.35236 |
800 +: | $ 0.33163 |
1200 +: | $ 0.30054 |
10000 +: | $ 0.26945 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | TO-252 (DPak) |
Attachment Method: | SMD Pad |
Shape: | Rectangular, Fins |
Length: | 0.320" (8.13mm) |
Width: | 0.790" (20.07mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.390" (9.91mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 25.00°C/W |
Material: | Copper |
Material Finish: | Tin |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks can help your electronic devices perform optimally by dissipating heat that can build up in components due to their complex circuit designs and semiconductor materials. The V-1100-SMD/B is a particularly effective Thermal - Heat Sink system that can help devices control their temperatures more efficiently and protect them from overheating. Here we\'ll discuss the application field and working principle of the V-1100-SMD/B.
Due to its efficient design, the V-1100-SMD/B is the ideal choice for devices that generate high levels of heat, such as high-powered CPUs and power management integrated circuits. The V-1100-SMD/B has enough thermal capacity to dissipate the heat generated by these devices, which helps them to maintain an optimal temperature and avoid overheating. In addition to its power handling capabilities, the V-1100-SMD/B has an optimized form factor that allows it to fit into devices that have limited space.
The working principle of the V-1100-SMD/B is based on its ability to dissipate heat from integrated circuits. The V-1100-SMD/B is made up of a block of metal that has fins that extend from its surface. These fins increase the surface area of the block and allow it to transfer more heat via convection. The heat is transferred from the fins to the surrounding air, which helps to keep the device\'s temperature stable. The V-1100-SMD/B also uses a thermal grease to improve heat transfer between the device and the heat sink.
In order to ensure the optimal performance of the V-1100-SMD/B, it is important that it is properly mounted on the device. The heat sink should be cleaned with a mild detergent and water prior to installation to remove any dust and dirt that may have accumulated on its surfaces. The heat sink should then be properly aligned and secured in place using screws. It is also important to ensure that the thermal grease is applied onto the device and the heat sink in the correct manner to ensure an adequate amount of heat transfer.
The V-1100-SMD/B is a highly effective Thermal-Heat Sink system that is ideal for devices that have limited space and generate high levels of heat. Its efficient design and well-thought-out form factor make it the perfect choice for devices that need to maintain optimal temperatures. Its ability to dissipate heat via convection and thermal grease gives it a considerable advantage over other heat sink systems. With proper installation and maintenance, the V-1100-SMD/B can help device perform optimally and protect them from overheating.
The specific data is subject to PDF, and the above content is for reference