| Allicdata Part #: | WA-T247-101E-ND |
| Manufacturer Part#: |
WA-T247-101E |
| Price: | $ 1.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | HEATSINK AND CLIP FOR TO-247 BLK |
| More Detail: | Heat Sink TO-247 Aluminum 1.0W @ 20°C Board Level,... |
| DataSheet: |  WA-T247-101E Datasheet/PDF |
| Quantity: | 6381 |
| 1 +: | $ 1.59390 |
| 10 +: | $ 1.55043 |
| 25 +: | $ 1.50822 |
| 50 +: | $ 1.42443 |
| 100 +: | $ 1.34064 |
| 250 +: | $ 1.25685 |
| 500 +: | $ 1.21495 |
| 1000 +: | $ 1.08927 |
| 5000 +: | $ 1.06833 |
| Series: | W |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-247 |
| Attachment Method: | Clip and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.260" (32.00mm) |
| Width: | 0.921" (23.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.630" (16.00mm) |
| Power Dissipation @ Temperature Rise: | 1.0W @ 20°C |
| Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | 7.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is essential for effective operation of all electronic systems. Heat sinks provide a means of dissipating thermal energy away from a component while increasing its thermal performance. The WA-T247-101E thermal heat sink provides an efficient solution to handle high-temperature environments. It is an ideal thermal management solution for a wide range of applications.
The WA-T247-101E is a simple yet effective heat sink designed to provide advanced thermal management solutions for both commercial and industrial applications. It utilizes a unique heat-dissipation technology which combines a robust aluminum extrusion frame, a copper heat spreader and a variety of spacers and screws to efficiently absorb and spread out thermal energy. This helps to reduce thermal stress on components and maintain a long service life.
Due to its small size and low cost, the WA-T247-101E is suitable for many different types of electronics and appliances. Its thermal heat sink efficiency makes it the perfect choice for processors, graphics cards, power supplies, motherboards, and other heat-sensitive components. It is also ideal for use in high-performance systems such as gaming rigs, servers, and other heavy-duty computing systems.
The WA-T247-101E’s working principle is based on enhanced surface area. The aluminum extrusion frame and copper heat spreader effectively dissipate heat from the component, while its various spacers and screws help to fit the heat sink snugly in place and evenly disperse the heat.
The WA-T247-101E is also extremely easy to use. Once installed, the heat sink can be used passively or actively, depending on the needs of the application. Passive heat sinks do not require any power, while active heat sinks require an external power source, such as a fan, to increase the cooling efficiency. In both cases, the heat sink will be able to dissipate the heat produced by the component, making it safer and more reliable.
The WA-T247-101E is an excellent choice for any electronic system. Its advanced heat dissipation technology helps to extend the component’s life while preventing it from overheating. It is a cost-effective, reliable, and efficient solution that is suitable for a wide range of applications and can be used both passively and actively.
The specific data is subject to PDF, and the above content is for reference