| Allicdata Part #: | WA-T264-101E-ND |
| Manufacturer Part#: |
WA-T264-101E |
| Price: | $ 1.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Ohmite |
| Short Description: | HEATSINK W/CLIP FOR TO-264 |
| More Detail: | Heat Sink TO-264 Aluminum 1.0W @ 20°C Board Level,... |
| DataSheet: |  WA-T264-101E Datasheet/PDF |
| Quantity: | 1240 |
| 1 +: | $ 1.53090 |
| 10 +: | $ 1.49184 |
| 25 +: | $ 1.45152 |
| 50 +: | $ 1.37088 |
| 100 +: | $ 1.29024 |
| 250 +: | $ 1.20960 |
| 500 +: | $ 1.16928 |
| 1000 +: | $ 1.04832 |
| 5000 +: | $ 1.02816 |
| Series: | W |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-264 |
| Attachment Method: | Clip and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.260" (32.00mm) |
| Width: | 0.921" (23.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.630" (16.00mm) |
| Power Dissipation @ Temperature Rise: | 1.0W @ 20°C |
| Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | 11.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management solutions are essential in protecting sensitive circuits and components from the damaging effects of extreme temperatures. This is where the WA-T264-101E heat sink comes in. It is designed to provide superior thermal management for today’s leading edge technologies, incorporating the latest advancements in thermal management solutions. The WA-T264-101E offers an optimal platform to protect and extend the life of electronic components and circuitry by allowing for maximum efficiency from the thermal management package.
The WA-T264-101E has a simple working principle that ensures effective thermal management. It is composed of an aluminum base plate, a copper heat spreader, and a thermal interface material (TIM). The aluminum base plate is the foundation of the heat sink, providing a sturdy and durable connection between the heat sink and the electronic components. The copper heat spreader is used to disperse the heat generated by the components to the ambient environment. The thermal interface material then fills any air gaps between the heat spreader and the aluminum base plate, ensuring the thermal energy is efficiently distributed to the environment.
The WA-T264-101E is typically used in high power applications, such as automobiles, medical, telecommunications, and power supplies. This heat sink can be used to prevent overheating of components and circuitry, and protect them from short circuiting. In automotive applications, the WA-T264-101E can be used to shield components from vibrations and harsh environmental conditions. In medical applications, it is used to extend the life of vital components and ensure the proper functioning of sensitive medical devices. In telecom applications, it can be used to dissipate the large amounts of heat generated by high speed data processing.
The WA-T264-101E has also been designed with durability and reliability in mind. It is constructed from aluminum, which is a robust yet lightweight material. The heat spreader is made of copper, which offers superior thermal conductivity, and ensures the heat generated by the components can be efficiently dissipated. The thermal interface material is also highly reliable and effective, ensuring the WA-T264-101E can provide maximum thermal management with minimal maintenance.
The WA-T264-101E is an ideal choice for applications requiring reliable thermal management solutions. It is designed to ensure optimum performance and extended life for sensitive components and circuitry. Its durable design ensures it can operate in even the most extreme conditions, and its thermal interface material guarantees efficient heat dissipation. With the WA-T264-101E, engineers can have confidence that their delicate electronic components are fully protected from overheating.
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