WAVE-23-125 Allicdata Electronics
Allicdata Part #:

345-1529-ND

Manufacturer Part#:

WAVE-23-125

Price: $ 1.27
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: ANCHOR HEATSINK 23X23X12.5MM
More Detail: Heat Sink BGA Aluminum Alloy Board Level
DataSheet: WAVE-23-125 datasheetWAVE-23-125 Datasheet/PDF
Quantity: 976
1 +: $ 1.15920
10 +: $ 1.09998
25 +: $ 1.07125
50 +: $ 1.04227
100 +: $ 0.98438
250 +: $ 0.92645
500 +: $ 0.86855
1000 +: $ 0.81065
5000 +: $ 0.78170
Stock 976Can Ship Immediately
$ 1.27
Specifications
Series: Wave 2x
Part Status: Active
Type: Board Level
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Angled Fins
Length: 0.906" (23.00mm)
Width: 0.906" (23.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.76°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important part of any electronic device, and heat sinks play a vital role in ensuring proper temperature regulation. The WAVE-23-125 is a type of aluminum heat sink specially designed for CPUs, GPUs, and other small-scale applications. It is suitable for both natural convection and forced convection cooling applications.

The WAVE-23-125 is a very lightweight heat sink, which is essential for providing maximum thermal performance. This is due to its advanced design which offers air channels to allow increased air flow through the heat sink. This design also ensures that the air evenly surrounds the temperature-sensitive components, providing more efficient cooling.

The WAVE-23-125 is made from high-quality aluminum with a specially designed fin array. The fin array helps to evenly spread out the heat away from the area of concentration, making it easier for the heat to escape. This helps to minimize the overall thermal load and increase the effectiveness of the cooling system.

In addition to the fin array, the WAVE-23-125 also features extruded fins. These fins are designed to maximize air flow and dissipate heat quickly. They are made from high-grade aluminum with a unique shape to allow air to pass through with ease. This helps to ensure that heat is dissipated quickly, and that the chip is not under constant stress from the temperature of the heat sink.

The WAVE-23-125 also features a bracket that helps to ensure easy installation. This bracket is designed to fit various configurations, and is easy to install. The bracket is also designed to allow for adjustable mounting options, so that the user can adjust the frame according to their individual needs.

The WAVE-23-125 is designed to meet the high demands of any application. With its strong design, low weight, and efficient cooling, it is the ideal solution for any system that requires efficient thermal management. In addition, it is extremely reliable and provides excellent performance even in demanding applications.

The WAVE-23-125 is a great choice for any application that requires excellent thermal management and efficient cooling. With its advanced design, high quality materials, and adjustable bracket, it is the perfect solution for any system.

The specific data is subject to PDF, and the above content is for reference

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