Allicdata Part #: | 345-1535-ND |
Manufacturer Part#: |
WAVE-35-12 |
Price: | $ 1.39 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | ANCHOR HEATSINK 35X35X12MM |
More Detail: | Heat Sink BGA Aluminum Alloy Board Level |
DataSheet: | WAVE-35-12 Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 1.26630 |
10 +: | $ 1.23606 |
25 +: | $ 1.20254 |
50 +: | $ 1.13576 |
100 +: | $ 1.06898 |
250 +: | $ 1.00218 |
500 +: | $ 0.96877 |
1000 +: | $ 0.86855 |
5000 +: | $ 0.85185 |
Specifications
Series: | Wave 3x |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | BGA |
Attachment Method: | Clip |
Shape: | Square, Angled Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.472" (12.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 3.83°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Overview of the WAVE-35-12
The WAVE-35-12 is an advanced technological thermal solution designed to dissipate and manage heat in various applications. It is a versatile heat sink solution that utilizes an optimized pin fin surface construction and efficient thermal performance design. It is specifically designed to fit into confined installation spaces, which reduces cooling requirements and minimizes size and weight. It is a thermal solution suitable for a wide range of industries, including aerospace, automotive, communications, electronics, industrial and medical.Thermal Performance
The WAVE-35-12 heat sink has outstanding thermal performance. It has a high thermal resistance, which is important for optimal heat dissipation and management. It has a high surface area, which increases the rate of heat dissipation and helps to manage temperature spikes. Additionally, it has a low windage loss, which helps to reduce overall power consumption.Design Features
The WAVE-35-12 heat sink is designed to be lightweight, yet robust and built for durability. It features a stainless steel reinforced pin-fin construction that optimizes airflow and heat transfer. This unique design helps to prevent breakage or distortion due to long-term use or unexpected environmental conditions. The fin spacing of the WAVE-35-12 also minimizes the periodic thermal losses and provides maximum thermal performance.Application Field and Working Principle
The WAVE-35-12 heat sink is primarily used for thermal solutions in a variety of industries, including aerospace, automotive, communications, electronics, industrial, and medical. It is designed to provide efficient heat dissipation and temperature management for high power electronic components and assemblies.The WAVE-35-12 works by transferring heat from the component or assembly to the air and dissipating it away from the component. It uses the principles of convection (the natural circulation of air from hotter to colder areas caused by density differences) and conduction (direct transfer of heat from one substance to another through contact) to dissipate heat from the component.The WAVE-35-12 utilizes a unique pin fin design to increase the rate of heat dissipation. The pin fins create turbulent airflow, which helps to whisk heat away from the component more quickly. Additionally, the large surface area of the pin fins helps to dissipate heat to the air more efficiently.Conclusion
The WAVE-35-12 heat sink is a versatile thermal solution suitable for a wide range of industries and applications. It provides efficient heat dissipation and thermal management for high power electronic components and assemblies. It has an optimized pin fin design that helps to increase the rate of heat dissipation and helps to dissipate heat from the component more quickly. Overall, the WAVE-35-12 represents an advanced and efficient thermal solution for dissipating and managing heat in a variety of applications.The specific data is subject to PDF, and the above content is for reference
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