WAVE-40-12 Allicdata Electronics
Allicdata Part #:

345-1540-ND

Manufacturer Part#:

WAVE-40-12

Price: $ 1.60
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: ANCHOR HEATSINK 40X40X12MM
More Detail: Heat Sink BGA Aluminum Alloy Board Level
DataSheet: WAVE-40-12 datasheetWAVE-40-12 Datasheet/PDF
Quantity: 994
1 +: $ 1.44900
10 +: $ 1.41246
25 +: $ 1.37441
50 +: $ 1.29805
100 +: $ 1.22170
250 +: $ 1.14534
500 +: $ 1.10716
1000 +: $ 0.99263
5000 +: $ 0.97354
Stock 994Can Ship Immediately
$ 1.6
Specifications
Series: Wave 4x
Part Status: Active
Type: Board Level
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Angled Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.36°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

WAVE-40-12 utilises a state-of-the-art, patented technology for thermal-heat sink applications. This compact and lightweight heat sink has a unique design that maximises air flow while providing superior thermal control and superb cooling performance. The unique design of the Wave-40-12 heat sink facilitates air flow at more than 150 linear feet of passage length, resulting in high thermal resistance and excellent thermal management.

The Wave-40-12 utilizes several components designed to maximize air flow. First, the heat sink includes an adjustable airfoil and vanes. The adjustable airfoils and vanes are designed to capture and channel the air flow, enabling it to efficiently transfer the heat away from the heat sink. The airfoils also add strength to the heat sink, allowing for more efficient operation at higher temperatures.

The Wave-40-12 also employs an effective interlocking system which minimizes air gaps between the turbulent air flow and the airfoils. This reduces the amount of turbulence which impedes the air flow, allowing for greater thermal control and cooling efficiency. Additionally, this interlocking component minimizes the noise associated with turbulent air flow, to ensure quiet operation.

The Wave-40-12 heat sink also has an advanced thermal interface material (TIM). This material is designed to provide superior thermal conductivity, and reduce the interface resistance between the heat sink and the microprocessors. The TIM is applied directly to the heat sink, minimizing the contact resistance and improving the overall thermal performance. Additionally, this TIM is corrosion and oxidation resistant for greater durability.

In addition to the advanced materials used in the Wave-40-12, the overall design of the heat sink maximizes the thermal efficiency. This is achieved by optimizing the air flow and deflecting the heat away from the microprocessor. The curved design of the heat sink also helps to direct the air flow away from the processor, increasing the efficiency by allowing for increased thermal control.

Finally, the Wave-40-12 heat sink also offers superior stability and can withstand extremes of temperature, from -60 to 200°C. This ensures reliable and durable performance for any application, from low power requirements to high power demands.

The Wave-40-12 heat sink is an innovative and reliable solution for thermal-heat sink applications. With its superior thermal control and cooling performance, reliability, and stability, the Wave-40-12 heat sink is an ideal choice for any application.

The specific data is subject to PDF, and the above content is for reference

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