XC17S30APD8C Allicdata Electronics
Allicdata Part #:

XC17S30APD8C-ND

Manufacturer Part#:

XC17S30APD8C

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC PROM SER 30000 C-TEMP 8-DIP
More Detail: N/A
DataSheet: XC17S30APD8C datasheetXC17S30APD8C Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tube 
Part Status: Obsolete
Programmable Type: OTP
Memory Size: 300kb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP
Base Part Number: XC17S30
Description

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XC17S30APD8C Configuration PROMs are specifically designed for FPGA applications. As an important part of the configuration of FPGAs, these memory devices are suited for a range of applications in the aerospace, industrial and commercial markets.

These Configuration PROMs offer features such as Organization (How Do FPGAs Work?) and compactness. When used in combination with the FPGA design tools, XC17S30APD8C Configuration PROMs can provide a very cost-effective and reliable solution for configuring FPGAs.

XC17S30APD8C Configuration PROMs are designed to store configuration information for the FPGA design system. This information provides the programmable logic with the necessary instructions to properly configure and to remain in the desired state. Configuration is a one-time operation and must be performed after power up.

The XC17S30APD8C Configuration PROMs have a unique feature which decreases the time required to program a large number of devices simultaneously. This feature also allows a wide range of configuration options to be used. In addition, the power and ground pins of the device are available to enable external power monitoring.

The XC17S30APD8C configuration process is a little different than that of some other common FPGA configuration memories. XC17S30APD8C is an internally segmented memory device, which makes configuration easier and faster. This device consists of two separate sections, an array and an address bus. The array holds configuration bits, coordinates and other related information required for FPGA configuration. The address bus is used to access the array for configuration purposes.

The advantages of the XC17S30APD8C Configuration PROMs include higher performance and flexibility in operating temperature, voltage and frequency ranges. On the other hand, these devices do not provide an address-mapping capability and require the use of a host processor to interpret the configuration bits. Additionally, the read-only nature of the device makes it non-upgradable and means that a new device must be purchased any time changes are made to the device.

The working principle of XC17S30APD8C Configuration PROMs is closely linked to their architecture. During the configuration process, the FPGA design tool is used to generate a configuration data file. This data file contains the address and bit information that the XC17S30APD8C device requires for programming. This data file is then loaded into the XC17S30APD8C device through a serial interface. During this transfer, the device also sends a series of signals, known as write select signals, that configure the FPGA.

Once the configuration data has been written to the XC17S30APD8C device, the configuration process is complete. The device then sends out a configuration success signal, which indicates that the FPGA has been configured successfully. The configuration success signal is then sent back to the host computer, which then performs the necessary software steps to complete the configuration process. This entire process typically takes less than one second.

In conclusion, XC17S30APD8C Configuration PROMs are an ideal solution for FPGA programming needs. These devices offer superior performance, flexibility, compactness and cost-effectiveness. Additionally, their architecture makes them easy to use and program. As a result, these Configuration PROMs are widely employed in various applications in the aerospace, industrial, and commercial markets.

The specific data is subject to PDF, and the above content is for reference

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