XG8W-3034

Rectangular Connectors - Headers, Male Pins

The XG8W-3034 are a family of rectangular connectors that are used in the majority of consumer electronics, computers, and communication and networking applications. These headers provide a reliable way to make electrical connections and extend the life of the component or system they are used in. XG8W-3034 headers are more commonly known as male header pins and feature two main components—a metal contact and a plastic housing.

Application Field

XG8W-3034 headers are mostly used in high-density applications such as advanced communications, high-speed data transfers, and other digital systems. These headers are designed to easily cater to the needs of today\'s rapidly advancing technology. Therefore, they are usually found in projects requiring multiple pins, such as PCI sockets, DVI ports, mini PCI cards and so on.

Working Principle

XG8W-3034 headers work by providing electrical connections between two components in an application. The two main components, the male metal contacts and the plastic housing, are usually shaped in an “X” design. The metal contact is inserted and soldered to the other component, while the plastic housing attaches to the other component, housing the contacts.

The XG8W-3034 headers enable two components to be connected without the need for using a traditional female and male connector. This makes the connection process simpler and quicker, as the two components can be connected without any additional components. Furthermore, these headers are also very reliable which means they can be used in applications where the connection may be disrupted or broken due to vibration or contact with other components.

Conclusion

The XG8W-3034 is an efficient and reliable connector that is used in a variety of applications. The two main components – the metal contact and the plastic housing – are designed to provide a secure and reliable electrical connection. Furthermore, these headers are easy to install and maintain, making them ideal for use in high-density applications.