XH3B-8041-4A Allicdata Electronics
Allicdata Part #:

XH3B-8041-4A-ND

Manufacturer Part#:

XH3B-8041-4A

Price: $ 4.03
Product Category:

Connectors, Interconnects

Manufacturer: Omron Electronics Inc-EMC Div
Short Description: CONN SKT 80POS 1.27MM GOLD
More Detail: 80 Position Connector Socket, Outer Shroud Contact...
DataSheet: XH3B-8041-4A datasheetXH3B-8041-4A Datasheet/PDF
Quantity: 1000
40 +: $ 3.66455
Stock 1000Can Ship Immediately
$ 4.03
Specifications
Series: XH3
Packaging: Bulk 
Part Status: Active
Connector Type: Socket, Outer Shroud Contacts
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Number of Rows: 2
Mounting Type: Through Hole
Features: Board Lock
Contact Finish: Gold
Contact Finish Thickness: --
Mated Stacking Heights: 16mm, 18mm, 20mm
Height Above Board: 0.524" (13.31mm)
Description

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XH3B-8041-4A connectors are designed to aid in a variety of applications ranging from data telecommunication to industrial automation. As part of the rectangular connectors, arrays, edge type, mezzanine (board to board) product series, XH3B-8041-4A connectors are easy to install and offer exceptional performance with high-speed data transmission and power requirements.

XH3B-8041-4A connectors are specifically designed for distributed computing systems, such as data centers. Its high density of connectors, combined with its easy segregation and installation makes these connectors the ideal choice when space is limited but maximum speed and connectivity is desired. XH3B-8041-4A connectors can also be utilized in a variety of industrial automation applications, from factory automation to process automation.

As a board-to-board connector, the XH3B-8041-4A connector is highly compatible with a wide range of standard printed circuit boards. Its robust design allows for a secure connection to other boards even after multiple mating cycles. The connector has a high power rating (up to 30A) and is available in a variety of voltage protection grades. Additionally, the XH3B-8041-4A has low heat generation and is ESD resistant.

The XH3B-8041-4A connector is a type of rectangular connector array, which consists of an arrangement of signal terminals that carry data and power in a single unit. The connectors are arranged in specialized board patterns to ensure quick installation and a secure connection. Furthermore, the connectors can be configured in various board arrangements to meet the requirements of each specific application.

The series offers an exceptional level of performance with its high-speed data transmission and high-power capabilities. The connector also features a unique self-cleaning structure which ensures a reliable and secure connection even after multiple mating cycles. The XH3B-8041-4A is also highly compatible with a variety of printed circuit boards, and its compact design allows for maximum flexibility when used in distributed computing systems. During the installation process, the connection structure of the connector is designed with keyed connections to help prevent accidental crosstalk. The series also features a non-volatile shunt mechanism which helps to ensure a secure connection even after multiple mating cycles.

As a board-to-board connector, the XH3B-8041-4A series is highly compatible with a variety of standard printed circuit boards. Its robust design allows for a secure connection to other boards even after multiple mating cycles. It has a high power rating (up to 30A) and is available in a variety of voltage protection grades. Additionally, the XH3B-8041-4A series is low heat generation and is ESD resistant.

In conclusion, the XH3B-8041-4A connectors offer excellent performance and reliability in a variety of applications, ranging from data telecommunication to industrial automation. Its robust structure and compatibility with a variety of printed circuit boards make it a suitable choice for distributed computing systems, as well as a number of industrial automation applications. The self-cleaning system also ensures a secure connection even after multiple mating cycles, making it an ideal choice for high-density, high-performance applications.

The specific data is subject to PDF, and the above content is for reference

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