XOMAP3503BCBB

The XOMAP3503BCBB is a highly integrated system-on-chip (SoC) designed with advanced low-power embedded multi-core technology. It is designed to provide the optimal performance with high single thread performance, allowing the user to maximize the performance and power efficiency. Moreover, it is capable of connecting to multiple peripheral devices through peripheral buses, such as High Speed Inter-Integrated Circuit (HSIIC), Peripheral Component Interconnect Express (PCIe), Serial Peripheral Interface (SPI), USB, and Ethernet. Furthermore, it provides a variety of peripherals such as USB 2.0, DisplayPort, Audio, Network Interface Controller (NIC), Flash Memory Controller (FMC) and Flash Programmable-Logic Device (FPLD).

The XOMAP3503BCBB offers a range of applications for embedded computing devices such as industrial automation, automotive systems, medical diagnosis, factory automation, energy conservation, and communications. It can be used to provide better performance, scalability, and power consumption in embedded devices. It has several features such as extended memory interface to support high-density DRAM modules with support for DDR2/DDR3 memories and enhanced programming model with single-cycle instruction execution. Additionally, it also offers multiple Digital Signal Processors (DSPs), multiple general purpose I/O (GPIO) connectors that can be configured to interface with a variety of external sensors, and multiple bidirectional communication channels.

The working principle of XOMAP3503BCBB is to deliver high-performance with low power consumption. The core is based on a multi-core architecture that consists of up to eight cores with each core running at an independent clock frequency and core voltage. Each core is capable of executing instructions from its own instruction set architecture (ISA). Additionally, the XOMAP3503BCBB also includes three branch prediction units, an out-of-order execution unit, a pre-fetch queue, and an instruction fetching mechanism that optimizes the instruction path and ensures that there are no stalls in the instruction fetching for a given task. Furthermore, it also includes hardware assisted branch prediction, instruction cache, and prefetching to the level 2 (L2) cache to increase instruction fetch performance.

The XOMAP3503BCBB also improves on memory bandwidth by supporting a single cycle DDR2/DDR3 interface, allowing it to be capable of transferring data between the external memory and an on-chip cache at speeds of up to 100 MHz. Furthermore, in order to improve on-board storage performance, the system also supports an Embedded Multi-port Memory System (eMMC), a scalable flash memory controller that enables the use of MLC NAND flash memory.

Furthermore, the XOMAP3503BCBB also supports several I/O solutions, such as USB 2.0, DisplayPort, Ethernet, audio input/output, and direct memory access (DMA) to allow for fast transfer from external memory to onboard memory as well as communication over USB or Ethernet. It also supports multiple communication buses such as PCI Express, Serial Peripheral Interface (SPI), USB, and I2C to provide a number of different ways to connect and communicate with a variety of different external devices.

In conclusion, the XOMAP3503BCBB is a highly integrated SoC that provides a number of features for embedded systems. It provides a number of advanced low-power features, a wide range of peripheral buses, and several I/O solutions that can be configured to suit any given application. With its high performance capabilities, low power consumption, and a wide range of supported external peripherals, it is an ideal SoC to be used in embedded applications.