XR3171EID-F

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XR3171EID-F is an integrated tri-level transceiver. It is designed with a low-voltage differential transmission line to provide high-speed, low-power data transmission as well as 10/100 Ethernet physical layer (PHY) applications. XR3171EID-F combines the speed of LVDS data transfer with the flexibility of a dual output clock and high impedance input circuitry.

The XR3171EID-F is an integrated interface device that provides fast, low-power, bidirectional data transmission and a dual-clocked system for USB, IEEE 1394 (FireWire), and 10/100 Ethernet applications. It operates from a single +3.3V supply, delivering up to 155Mbps data rate and a low-power operation at 3mA. The XR3171EID-F also features LVDS transceiver circuitry with differential loopback, 3.3V tolerant inputs, and a low-voltage differential signal implemented in balanced transmission line formats.

The XR3171EID-F is designed to complement existing communication interface standards such as Ethernet, SONET/SDH, ATM, Fast Ethernet, Gigabit Ethernet, Fibre Channel, WAN, Local Area Network (LAN), and Serial Boulevard. It provides high-speed data transmission, and low-power operation, as well as an integrated dual clock output system and a data signal generator.

The XR3171EID-F incorporates an LVDS transceiver architecture that supports both full-duplex and half-duplex data communication. The LVDS transceiver includes two differential signal outputs and two differential digital logic inputs and outputs. The two outputs feature a differential signal level and a dual output clock. The digital logic input features a 3.3V-tolerant digital input, and the digital logic output utilizes a high-impedance card. The dual output clock is programmed to send a single clock cycle for every four bytes of data sent.

The XR3171EID-F includes two output channels, a data signal generator, and programmable data rate, as well as an LVDS loopback. The input and output channels of the XR3171EID-F are able to operate at speeds up to 8.3Gbps and are capable of handling duty cycles up to 75%.

The XR3171EID-F is designed to provide reliable and fast communication between networks and devices in a variety applications. It allows for simple integration into existing communication systems, reduces power consumption and increases the data transmission rate by taking advantage of the LVDS communication standard. In addition, the XR3171EID-F is optimized for use in applications where power dissipation and space are at a premium.

The XR3171EID-F is used in various applications including switching power supplies, video capture and playback, serial data communications, and point-to-point communication. It is also used in multiple levels of memory systems such as DRAM, DRAM parity, SDRAM, side chip and dual channel DDR. The XR3171EID-F is designed to be compatible with all current interface standards and multiple existing communication architectures.

The XR3171EID-F is built to the highest specifications and provides superior performance. It offers low-power operation, flexible design and reliable data transmission. It is an ideal choice for applications requiring high-performance, low-power and high-speed data transmission. The XR3171EID-F is an efficient, reliable, and cost-effective solution for applications in computing, communications and networking.

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