ZOE-M8Q RF/IF and RFID

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1. Description

ZOE-M8Q is u-blox's ultra-small, highly integrated GNSS SiP (system in package) module for measurement Only 4.5 x 4.5 x 1.0 mm. Utilizing Super-E mode, ZOE-M8B provides an ideal balance in the following aspects Miniature size, low power consumption and good GNSS performance. Super-E mode has two settings: "Performance" (default setting) can achieve the best balance between power and performance; "Energy saving" At the cost of positioning accuracy, power is further saved. In Super-E mode, ZOE-M8B The power consumption is 2.5 times that of the traditional M8 GNSS module with concurrent GNSS receiving function In 1 Hz full power mode, while still maintaining good positioning and speed accuracy. Average power Using AssistNow Offline data, the power consumption on a typical 30-minute track will be as low as 25 mW And industrial antenna design (ie, low to medium signal level). ZOE-M8B based on TCXO integrates a front-end SAW filter and an additional front-end LNA for Enhanced anti-interference ability, easier to integrate antenna. Can use passive antenna Provide highly integrated system solutions with minimal eBOM. Integrating ZOE-M8B into customer design is very simple and clear Integrated design, 1.8 V single power supply, simple interface and complex interference Even in the harsh environment of GNSS, maximum performance suppression can be ensured. apart from ZOE-M8B provides an SQI interface for optional external flash memory, continuous data recording and improvement A-GNSS performance. ZOE-M8B is based on the high performance of the u-blox M8 concurrent GNSS engine, which supports GPS/GLONASS/Beidou/Galileo, including message integrity protection, anti-jamming and anti-spoofing. All these functions together provide reliable positioning in harsh environments Conditions and involve security attacks. ZOE-M8B is an ideal, fully integrated SiP solution for battery-powered wearable and portable The device has low power consumption, small size and good GNSS performance. ZOE-M8B can be easily integrated into manufacturing through advanced S-LGA (welding) Ground grid array) packaging technology can achieve a simpler and more reliable welding process Compared with ordinary LGA package.

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4. Mechanical specification