Aec-q101 switching controllers - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
428-4402-ND	CYPD3174-16SXQ	Cypress Semiconductor Corp	View more Series: EZ-PD CCG3PA Packaging: Tube Part Status: Active Applications: USB Type C Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 8K x 8 Interface: IC, SPI, UART Number of I/O: 5 Voltage - Supply: 3 V ~ 24.5 V Operating Temperature: -40C ~ 105C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	2 Order	1+: $2.4192 10+: $2.1578 25+: $1.9419 100+: $1.7694 480+: $1.5967 960+: $1.2947 1440+: $1.2083 2880+: $1.1479 5280+: $1.1048
428-2964-ND	CY7C64343-32LQX C	Cypress Semiconductor Corp	View more Series: enCoRe V Packaging: Tray Part Status: Active Applications: USB Microcontroller Core Processor: M8C Program Memory Type: FLASH (8 kB) Controller Series: CY7C643xx RAM Size: 1K x 8 Interface: IC, SPI, USB Number of I/O: 25 Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 32-UFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5) Base Part Number: CY7C64343	1081 Order	--
428-2888-ND	CY7C64355-48LFX C	Cypress Semiconductor Corp	View more Series: enCoRe V Packaging: Tray Part Status: Obsolete Applications: USB Microcontroller Core Processor: M8C Program Memory Type: FLASH (16 kB) Controller Series: CY7C643xx RAM Size: 1K x 8 Interface: IC, SPI, USB Number of I/O: 36 Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7) Base Part Number: CY7C64355	1000 Order	1+: $0
428-4404-ND	CYPD3175-24LQXQ	Cypress Semiconductor Corp	View more Series: EZ-PD CCG3PA Packaging: Tray Part Status: Active Applications: USB Type C Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 8K x 8 Interface: IC, SPI, UART Number of I/O: 12 Voltage - Supply: 3 V ~ 24.5 V Operating Temperature: -40C ~ 105C (TA) Mounting Type: Surface Mount Package / Case: 24-UFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	1000 Order	1+: $2.2932 10+: $2.0475 25+: $1.8429 100+: $1.679 490+: $1.5152 980+: $1.2285 1470+: $1.1466 2940+: $1.0893 5390+: $1.0483
428-4403-ND	CYPD3174-24LQXQ	Cypress Semiconductor Corp	View more Series: EZ-PD CCG3PA Packaging: Tray Part Status: Active Applications: USB Type C Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 8K x 8 Interface: IC, SPI, UART Number of I/O: 12 Voltage - Supply: 3 V ~ 24.5 V Operating Temperature: -40C ~ 105C (TA) Mounting Type: Surface Mount Package / Case: 24-UFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	452 Order	1+: $2.2932 10+: $2.0475 25+: $1.8429 100+: $1.679 490+: $1.5152 980+: $1.2285 1470+: $1.1466 2940+: $1.0893 5390+: $1.0483
428-2890-ND	CY7C64356-48LTX C	Cypress Semiconductor Corp	View more Series: enCoRe V Packaging: Tray Part Status: Active Applications: USB Microcontroller Core Processor: M8C Program Memory Type: FLASH (32 kB) Controller Series: CY7C643xx RAM Size: 2K x 8 Interface: IC, SPI, USB Number of I/O: 36 Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7) Base Part Number: CY7C64356	135 Order	1+: $3.1374 10+: $2.8035 25+: $2.5233 100+: $2.2989 260+: $2.0746 520+: $1.8615 1040+: $1.57 2600+: $1.4915
428-4401-ND	CYPD3171-24LQXQ	Cypress Semiconductor Corp	View more Series: EZ-PD CCG3PA Packaging: Tray Part Status: Active Applications: USB Type C Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 8K x 8 Interface: IC, SPI, UART Number of I/O: 12 Voltage - Supply: 3 V ~ 24.5 V Operating Temperature: -40C ~ 105C (TA) Mounting Type: Surface Mount Package / Case: 24-UFQFN Exposed Pad Supplier Device Package: 24-QFN (4x4)	437 Order	1+: $2.52 10+: $2.2523 25+: $2.0271 100+: $1.8469 490+: $1.6667 980+: $1.3514 1470+: $1.2613 2940+: $1.1982 5390+: $1.1532
MM908E624ACEW-N D	MM908E624ACEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624ACEWR2 TR-ND	MM908E624ACEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624ACDWBR 2-ND	MM908E624ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624ACDWB- ND	MM908E624ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624AYEW-N D	MM908E624AYEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624AYEWR2 -ND	MM908E624AYEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	1+: $0
STA1052N1TR-ND	STA1052N1TR	STMicroelectronics	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM7 Program Memory Type: ROM (384 kB) RAM Size: 128K x 8 Interface: IC, IS, SPI, UART, USB Voltage - Supply: 1.71 V ~ 1.89 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	500+: $4.3943
LX3301A-ND	LX3301A	Microsemi Corporation	View more Series: Automotive, AEC-Q100 Part Status: Active Applications: Inductive Sensor Interface Core Processor: 32-Bit RISC Program Memory Type: ROM (12 kB) Interface: Analog, PWM Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP	1000 Order	2500+: $0.8793
STA1052Z2-ND	STA1052Z2	STMicroelectronics	View more Series: Automotive, AEC-Q100 Packaging: Tray Part Status: Active Applications: Automotive Core Processor: ARM7 Program Memory Type: ROM (384 kB) RAM Size: 128K x 8 Interface: IC, IS, SPI, UART, USB Voltage - Supply: 1.71 V ~ 1.89 V Operating Temperature: -40C ~ 85C Mounting Type: Chassis Mount Package / Case: STAC177B Supplier Device Package: STAC177B Base Part Number: STA1052	4483 Order	--
STA1052N1-ND	STA1052N1	STMicroelectronics	View more Series: Automotive, AEC-Q100 Packaging: Tray Part Status: Active Applications: Automotive Core Processor: ARM7 Program Memory Type: ROM (384 kB) RAM Size: 128K x 8 Interface: IC, IS, SPI, UART, USB Voltage - Supply: 1.71 V ~ 1.89 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	--
568-14487-ND	MM912G634DV1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	250 Order	--
MM912F634DV2AE- ND	MM912F634DV2AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
MM912G634DC1AE- ND	MM912G634DC1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	250+: $4.3268
MM912G634DV2AP- ND	MM912G634DV2AP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	--
MM912G634DC2APR 2-ND	MM912G634DC2APR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.1505
568-14486-ND	MM912H634DV1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	250 Order	--
MM912F634DV2APR 2-ND	MM912F634DV2APR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912F634	1000 Order	2000+: $1.8937
MM912G634DM1AE- ND	MM912G634DM1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	250+: $5.0016
MM912F634DV1AE- ND	MM912F634DV1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
MM912G634DC2AP- ND	MM912G634DC2AP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	250+: $4.027
MM912F634DV2AP- ND	MM912F634DV2AP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912F634	1000 Order	--
MM912G634DV2APR 2-ND	MM912G634DV2APR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.6281
568-14449-ND	MM912H634DM1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	250 Order	--
MM912G634DC1AER 2-ND	MM912G634DC1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.3851
MM912H634DM1AER 2-ND	MM912H634DM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	1000 Order	2000+: $1.8434
MM912H634DV1AER 2-ND	MM912H634DV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	1000 Order	--
MM912F634DV2AER 2-ND	MM912F634DV2AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	2000+: $1.3239
MM912F634DV1AER 2-ND	MM912F634DV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	2000+: $1.9272
MM912G634DM1AER 2-ND	MM912G634DM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.913
MM912G634DV1AER 2-ND	MM912G634DV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $1.4244
TLE9871QXA20XUM A1-ND	TLE9871QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (36 kB) RAM Size: 3K x 8 Interface: SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $1.8983
TLE9877QXA20XUM A1-ND	TLE9877QXA20XUM A1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Applications: Automotive Core Processor: ARM Cortex-M3 Program Memory Type: FLASH (64 kB) RAM Size: 6K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40C ~ 150C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-29	1000 Order	2500+: $2.0837
TLE98442QXXUMA1 TR-ND	TLE98442QXXUMA1	Infineon Technologies	View more Series: Automotive, AEC-Q100 Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (64 kB) RAM Size: 4K x 8 Interface: LIN, SSI, UART Number of I/O: 10 Voltage - Supply: 3 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: PG-VQFN-48-31	2500 Order	2500+: $1.3688

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