Arm microcontroller ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
5CSEMA6F31A7N-N D	5CSEMA6F31A7N	Intel FPGAs/Altera	View more Series: Automotive, AEC-Q100, Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: -40C ~ 125C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: MCU - 181, FPGA - 288 Base Part Number: 5CSEMA6	1000 Order	27+: $205.33
XCZU4CG-1FBVB90 0I-ND	XCZU4CG-1FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
122-2100-ND	XC7Z010-1CLG225 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 28K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Number of I/O: 86 Base Part Number: XC7Z010	1000 Order	--
122-2081-ND	XC7Z020-1CLG400 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 85K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 130 Base Part Number: XC7Z020	1000 Order	1+: $24.62
XA7Z020-1CLG400 I-ND	XA7Z020-1CLG400 I	Xilinx Inc.	View more Series: Automotive, AEC-Q100, Zynq-7000 XA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 85K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 130	1000 Order	3+: $84.1869
XCZU2CG-2SFVA62 5I-ND	XCZU2CG-2SFVA62 5I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	1000 Order	--
XCZU2CG-L2SBVA4 84E-ND	XCZU2CG-L2SBVA4 84E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	1+: $217.854
122-1852-ND	XC7Z010-2CLG400 I	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 28K Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 130 Base Part Number: XC7Z010	1 Order	--
XCZU7CG-1FFVC11 56E-ND	XCZU7CG-1FFVC11 56E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $1.26
XCZU6CG-L2FFVC9 00E-ND	XCZU6CG-L2FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU5CG-1SFVC78 4E-ND	XCZU5CG-1SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $0.63
XCZU6CG-L1FFVB1 156I-ND	XCZU6CG-L1FFVB1 156I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	1+: $1.26
5CSEMA5F31A7N-N D	5CSEMA5F31A7N	Intel FPGAs/Altera	View more Series: Automotive, AEC-Q100, Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40C ~ 125C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: MCU - 181, FPGA - 288 Base Part Number: 5CSEMA5	446 Order	27+: $155.271
XCZU4EG-3FBVB90 0E-ND	XCZU4EG-3FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
5CSEMA5U23A7N-N D	5CSEMA5U23A7N	Intel FPGAs/Altera	View more Series: Automotive, AEC-Q100, Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40C ~ 125C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Number of I/O: MCU - 181, FPGA - 145 Base Part Number: 5CSEMA5	1000 Order	60+: $139.073
122-2186-ND	XC7Z020-3CLG400 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 866MHz Primary Attributes: Artix-7 FPGA, 85K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 130 Base Part Number: XC7Z020	90 Order	--
XCZU4CG-1SFVC78 4E-ND	XCZU4CG-1SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU5CG-L2SFVC7 84E-ND	XCZU5CG-L2SFVC7 84E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $0.63
XCZU6CG-L1FFVC9 00I-ND	XCZU6CG-L1FFVC9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XC7Z010-2CLG225 E-ND	XC7Z010-2CLG225 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 28K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Number of I/O: 86 Base Part Number: XC7Z010	1000 Order	--
122-1827-ND	XC7Z020-1CLG484 CES	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 85K Logic Cells Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19) Number of I/O: 130 Base Part Number: XC7Z020	1000 Order	1+: $0
XCZU3CG-L2SBVA4 84E-ND	XCZU3CG-L2SBVA4 84E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	1+: $347.256
XCZU9CG-L1FFVC9 00I-ND	XCZU9CG-L1FFVC9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU5EG-3FBVB90 0E-ND	XCZU5EG-3FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU9CG-1FFVB11 56E-ND	XCZU9CG-1FFVB11 56E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	1+: $1.26
XCZU4CG-2FBVB90 0I-ND	XCZU4CG-2FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
5CSXFC2C6U23A7N -ND	5CSXFC2C6U23A7N	Intel FPGAs/Altera	View more Series: Automotive, AEC-Q100, Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 25K Logic Elements Operating Temperature: -40C ~ 125C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Number of I/O: MCU - 181, FPGA - 145	1000 Order	60+: $98.0413
122-2054-ND	XCZU2CG-L1SFVA6 25I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	45 Order	1+: $199.836
XCZU3CG-2SBVA48 4I-ND	XCZU3CG-2SBVA48 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	1+: $347.256
5CSEBA5U23A7N-N D	5CSEBA5U23A7N	Intel FPGAs/Altera	View more Series: Automotive, AEC-Q100, Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40C ~ 125C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Number of I/O: MCU - 181, FPGA - 145 Base Part Number: 5CSEBA5	1000 Order	60+: $133.674
XCZU7CG-1FFVC11 56I-ND	XCZU7CG-1FFVC11 56I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $1.26
XCZU5CG-2SFVC78 4E-ND	XCZU5CG-2SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $0.63
XCZU7CG-L1FFVF1 517I-ND	XCZU7CG-L1FFVF1 517I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	1+: $1.89
XCZU4CG-L1FBVB9 00I-ND	XCZU4CG-L1FBVB9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU7CG-2FBVB90 0I-ND	XCZU7CG-2FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU7CG-L2FFVF1 517E-ND	XCZU7CG-L2FFVF1 517E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	1+: $1.89
122-2099-ND	XC7Z010-2CLG400 E	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix-7 FPGA, 28K Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17) Number of I/O: 130 Base Part Number: XC7Z010	80 Order	--
XCZU4CG-2SFVC78 4E-ND	XCZU4CG-2SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU7CG-2FFVF15 17E-ND	XCZU7CG-2FFVF15 17E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	1+: $1.89
XCZU2CG-1SFVA62 5I-ND	XCZU2CG-1SFVA62 5I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	1000 Order	--

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