Audio ic processor - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
ADBF561WBBCZ505 -ND	ADBF561WBBCZ505	Analog Devices Inc.	View more Series: Blackfin Packaging: Tray Part Status: Obsolete Type: Fixed Point Interface: SPI, SSP, UART Clock Rate: 533MHz Non-Volatile Memory: External On-Chip RAM: 328kB Voltage - I/O: 3.30V Voltage - Core: 1.25V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-CSPBGA (17x17) Base Part Number: ADBF561	1000 Order	1+: $0
BCM6515IPB-ND	BCM6515IPB	Broadcom Limited	View more Series: * Part Status: Active	1000 Order	1+: $0
BCM6515IPBG-ND	BCM6515IPBG	Broadcom Limited	View more Series: * Part Status: Active	1000 Order	1+: $0
AU1250-500MGF-N D	AU1250-500MGF	Broadcom Limited	View more Series: * Part Status: Obsolete	1000 Order	--
BCM6517IPBG-ND	BCM6517IPBG	Broadcom Limited	View more Series: * Part Status: Active	1000 Order	1+: $0
XLR73222WD1000- ND	XLR73222WD1000	Broadcom Limited	View more Series: * Part Status: Obsolete	1000 Order	1+: $0
ADBF544WBBCZ504 -ND	ADBF544WBBCZ504	Analog Devices Inc.	View more Series: Blackfin Packaging: Tray Part Status: Obsolete Type: Fixed Point Interface: CAN, SPI, SSP, TWI, UART Clock Rate: 533MHz Non-Volatile Memory: External On-Chip RAM: 196kB Voltage - I/O: 2.50V, 3.30V Voltage - Core: 1.25V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17)	1000 Order	1+: $0
0625001747-ND	0625001747	Molex, LLC	View more Series: * Part Status: Active	1000 Order	1+: $0
8227350000-ND	8227350000	Weidmuller	View more Series: MCZ Part Status: Active Type: Process Sensing Trip Status: Energized High/Low Delay Time: No Delay Voltage - Supply: 24VDC Output Type: Solid State Circuit: SPST-NO (1 Form A) x 2 Mounting Type: DIN Rail Operating Temperature: 0C ~ 50C	1000 Order	1+: $97.9146
AU1000-266MCF-N D	AU1000-266MCF	Broadcom Limited	View more Series: * Part Status: Obsolete	1000 Order	1+: $0
AU1250-600MGD-N D	AU1250-600MGD	Broadcom Limited	View more Series: * Part Status: Obsolete	1000 Order	--
BCM2070CB0KUFBX GT-ND	CYW2070CB0KUFBX GT	Cypress Semiconductor Corp	View more Series: * Part Status: Active	1000 Order	2500+: $2.2277
8260280000-ND	8260280000	Weidmuller	View more Series: MCZ Part Status: Active Type: Process Sensing Trip Range: 0 ~ 10V Delay Time: No Delay Voltage - Supply: 24VDC Output Type: Solid State Circuit: PNP Mounting Type: DIN Rail Operating Temperature: 0C ~ 50C	1000 Order	1+: $93.2337
ADBF561WBBZ505- ND	ADBF561WBBZ505	Analog Devices Inc.	View more Series: Blackfin Packaging: Tray Part Status: Obsolete Type: Fixed Point Interface: SPI, SSP, UART Clock Rate: 533MHz Non-Volatile Memory: External On-Chip RAM: 328kB Voltage - I/O: 3.30V Voltage - Core: 1.25V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 297-BGA Supplier Device Package: 297-PBGA (27x27) Base Part Number: ADBF561	1000 Order	--
FSA223UMX_F106- ND	FSA223UMX_F106	ON Semiconductor	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Obsolete Applications: Audio, USB Switch Circuit: DPDT Number of Channels: 1 On-State Resistance (Max): 6 Ohm (USB), 6 Ohm (Audio) Voltage - Supply, Single (V+): 2.7 V ~ 5.5 V -3db Bandwidth: 720MHz Features: USB 2.0 Operating Temperature: -40C ~ 85C (TA) Package / Case: 10-UFQFN Supplier Device Package: 10-UMLP (1.8x1.4) Base Part Number: FSA223	1000 Order	1+: $0
LM49450SQ/NOPBT R-ND	LM49450SQ/NOPB	Texas Instruments	View more Series: Boomer Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Type: Class D Output Type: 2-Channel (Stereo) with Stereo Headphones Max Output Power x Channels @ Load: 2.5W x 2 @ 4 Ohm Voltage - Supply: 2.7 V ~ 5.5 V Features: 3D, DAC, Depop, IC, IS, Mute, Short-Circuit and Thermal Protection, Shutdown, Volume Control Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 32-WQFN (5x5) Package / Case: 32-WFQFN Exposed Pad Base Part Number: LM49450	1000 Order	--
296-35564-2-ND	LM49350RL/NOPB	Texas Instruments	View more Series: Boomer Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Type: Class D Output Type: 1-Channel (Mono) with Mono and Stereo Headphones Max Output Power x Channels @ Load: 2W x 1 @ 4 Ohm; 69mW x 2 @ 32 Ohm Voltage - Supply: 2.7 V ~ 5.5 V Features: 3D, DAC, Depop, IC, IS, Mute, Short-Circuit and Thermal Protection, Shutdown, Volume Control Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 36-DSBGA (3.5x3.24) Package / Case: 36-WFBGA, DSBGA Base Part Number: LM49350	500 Order	--
TDF8599ATH/N2,5 12-ND	TDF8599ATH/N2,5 12	NXP USA Inc	View more Series: TDF8599 Packaging: Tube Lead Free Status / RoHS Status: ROHS3 Compliant Part Status: Obsolete Moisture Sensitivity Level (MSL): 3 (168 Hours) Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 250W x 1 @ 2 Ohm; 135W x 2 @ 4 Ohm Voltage - Supply: 8 V ~ 35 V Features: Depop, Differential Inputs, IC, Mute, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 36-HSOP Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Base Part Number: TDF8599	21900 Order	--
296-41438-2-ND	LM49352RL/NOPB	Texas Instruments	View more Series: Boomer, PowerWise Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Type: Class D Output Type: 1-Channel (Mono) with Mono and Stereo Headphones Max Output Power x Channels @ Load: 1.4W x 1 @ 8 Ohm; 65mW x 2 @ 32 Ohm Features: Depop, Differential Inputs, IC, IS, Microphone, Shutdown, Volume Control Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 36-DSBGA (3.5x3.24) Package / Case: 36-WFBGA, DSBGA Base Part Number: LM49352	250 Order	--
M2S010TS-VF256- ND	M2S010TS-VF256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-VFBGA Supplier Device Package: 256-BGA (17x17) Number of I/O: 138	1000 Order	119+: $23.7857
M2S010T-VFG256I -ND	M2S010T-VFG256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $23.0485
M2S050TS-1FGG89 6-ND	M2S050TS-1FGG89 6	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377	1000 Order	27+: $92.085
M2S150-FCSG536- ND	M2S150-FCSG536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $165.008
M2S050S-1FGG484 I-ND	M2S050S-1FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S050S	1000 Order	1+: $0
M2S050T-FCSG325 -ND	M2S050T-FCSG325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $49.4991
M2S060T-1FG484- ND	M2S060T-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $74.4296
M2S060TS-1FG676 I-ND	M2S060TS-1FG676 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $92.085
M2S050T-1FG896I -ND	M2S050T-1FG896I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050T	1000 Order	27+: $92.085
M2S150-FCS536-N D	M2S150-FCS536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $165.008
M2S090S-1FG676I -ND	M2S090S-1FG676I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 425 Base Part Number: M2S090S	1000 Order	1+: $0
M2S005-TQG144-N D	M2S005-TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $10.1048
M2S010-VFG256-N D	M2S010-VFG256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $19.7786
M2S010TS-VFG256 I-ND	M2S010TS-VFG256 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $26.4316
M2S025TS-VFG256 -ND	M2S025TS-VFG256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $43.8348
M2S025T-1VF400- ND	M2S025T-1VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 Base Part Number: M2S025T	1000 Order	90+: $45.2882
M2S025T-1VFG400 I-ND	M2S025T-1VFG400 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 Base Part Number: M2S025T	1000 Order	90+: $50.3243
M2S060TS-1VFG40 0I-ND	M2S060TS-1VFG40 0I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $86.8273
M2S005S-1VF400- ND	M2S005S-1VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 169	1000 Order	90+: $14.7263
M2S090-FCSG325- ND	M2S090-FCSG325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $62.985
M2S060TS-1FGG67 6-ND	M2S060TS-1FGG67 6	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $86.8616

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