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Search Result:automotive gate driver

 --128 Item(s) In Category:Embedded - Microcontrollers - Application Specific

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Photo Allicdata Part# Mft.Part# Company Spec. QTY. Pricing(USD) PDF
MM912F634CV2APR2 MM912F634CV2APR
2-ND		 MM912F634CV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634CV2APR2-ND Datasheet
MM912F634CV2AP MM912F634CV2AP-
ND		 MM912F634CV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634CV2AP-ND Datasheet
MM912G634DM1AE MM912G634DM1AE-
ND		 MM912G634DM1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

250+:

$5.0016

 MM912G634DM1AE-ND Datasheet
MM912F634CV2AE MM912F634CV2AE-
ND		 MM912F634CV2AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634CV2AE-ND Datasheet
MM912F634BV1AE MM912F634BV1AE-
ND		 MM912F634BV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634BV1AE-ND Datasheet
MM912F634DV1AE MM912F634DV1AE-
ND		 MM912F634DV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634DV1AE-ND Datasheet
MM912G634DC2AP MM912G634DC2AP-
ND		 MM912G634DC2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

250+:

$4.027

 MM912G634DC2AP-ND Datasheet
MM912F634DV2AP MM912F634DV2AP-
ND		 MM912F634DV2AP NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634DV2AP-ND Datasheet
MM912G634DV2APR2 MM912G634DV2APR
2-ND		 MM912G634DV2APR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP
 Supplier Device Package: 48-LQFP (7x7)
 Base Part Number: MM912G634
1000
Order

2000+:

$3.6281

 MM912G634DV2APR2-ND Datasheet
MM912F634CV1AE MM912F634CV1AE-
ND		 MM912F634CV1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

--

 MM912F634CV1AE-ND Datasheet
TLE9834QXXUMA2 TLE9834QXXUMA2-
ND		 TLE9834QXXUMA2 Infineon Technologies
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: XC800
 Program Memory Type: FLASH (64 kB)
 RAM Size: 3.25K x 8
 Interface: LIN, SSI, UART
 Number of I/O: 11
 Voltage - Supply: 3 V ~ 27 V
 Operating Temperature: -40C ~ 150C (TJ)
 Mounting Type: Surface Mount
 Package / Case: 48-VFQFN Exposed Pad
 Supplier Device Package: PG-VQFN-48-29
1000
Order

1+:

$0

 TLE9834QXXUMA2-ND Datasheet
MM912H634DM1AE 568-14449-ND MM912H634DM1AE NXP USA Inc
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
250
Order

--

 568-14449-ND Datasheet
MB88121CPMC1-GS-N2E2 428-4313-ND MB88121CPMC1-GS
-N2E2		 Cypress Semiconductor Corp
View more  Packaging: Tray
 Part Status: Active
 Applications: Automotive
 Core Processor: External
 Program Memory Type: External Program Memory
 RAM Size: 8K x 8
 Interface: Parallel Host, SPI
 Voltage - Supply: 1.65 V ~ 5.5 V
 Operating Temperature: -40C ~ 125C (TA)
 Mounting Type: Surface Mount
 Package / Case: 64-LQFP
 Supplier Device Package: 64-LQFP (10x10)
220
Order

1+:

$12.6

10+:

$11.655

25+:

$10.71

160+:

$9.954

320+:

$9.135

640+:

$8.694

 428-4313-ND Datasheet
MM908E626AVPEK MM908E626AVPEK-
ND		 MM908E626AVPEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 115C
 Mounting Type: Surface Mount
 Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E626
1000
Order

--

 MM908E626AVPEK-ND Datasheet
MM908E622ACDWB MM908E622ACDWB-
ND		 MM908E622ACDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E622
1000
Order

--

 MM908E622ACDWB-ND Datasheet
MM912G634CV1AER2 MM912G634CV1AER
2-ND		 MM912G634CV1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.25 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

1+:

$0

 MM912G634CV1AER2-ND Datasheet
MM908E621ACDWB MM908E621ACDWB-
ND		 MM908E621ACDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E621
1000
Order

1+:

$0

 MM908E621ACDWB-ND Datasheet
MM908E621ACDWBR2 MM908E621ACDWBR
2-ND		 MM908E621ACDWBR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E621
1000
Order

1+:

$0

 MM908E621ACDWBR2-ND Datasheet
MM912F634BV1AER2 MM912F634BV1AER
2-ND		 MM912F634BV1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

1+:

$0

 MM912F634BV1AER2-ND Datasheet
MM912G634DC1AER2 MM912G634DC1AER
2-ND		 MM912G634DC1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

2000+:

$3.3851

 MM912G634DC1AER2-ND Datasheet
MM912H634DM1AER2 MM912H634DM1AER
2-ND		 MM912H634DM1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
1000
Order

2000+:

$1.8434

 MM912H634DM1AER2-ND Datasheet
MM908E624ACEW MM908E624ACEW-N
D		 MM908E624ACEW NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACEW-ND Datasheet
MM908E625ACPEKR2 MM908E625ACPEKR
2-ND		 MM908E625ACPEKR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC
1000
Order

1000+:

$3.5211

 MM908E625ACPEKR2-ND Datasheet
MM912H634DV1AER2 MM912H634DV1AER
2-ND		 MM912H634DV1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
1000
Order

--

 MM912H634DV1AER2-ND Datasheet
MM908E624ACEWR2 MM908E624ACEWR2
TR-ND		 MM908E624ACEWR2 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACEWR2TR-ND Datasheet
MM908E624ACDWBR2 MM908E624ACDWBR
2-ND		 MM908E624ACDWBR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACDWBR2-ND Datasheet
MM908E622ACEK MM908E622ACEK-N
D		 MM908E622ACEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E622
1000
Order

--

 MM908E622ACEK-ND Datasheet
MM908E621ACPEKR2 MM908E621ACPEKR
2-ND		 MM908E621ACPEKR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC W EP
 Base Part Number: MM908E621
1000
Order

1000+:

$3.5721

 MM908E621ACPEKR2-ND Datasheet
MM912F634DV2AER2 MM912F634DV2AER
2-ND		 MM912F634DV2AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

2000+:

$1.3239

 MM912F634DV2AER2-ND Datasheet
MM912F634DV1AER2 MM912F634DV1AER
2-ND		 MM912F634DV1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (32 KB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912F634
1000
Order

2000+:

$1.9272

 MM912F634DV1AER2-ND Datasheet
MM908E626AVPEKR2 MM908E626AVPEKR
2-ND		 MM908E626AVPEKR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 115C
 Mounting Type: Surface Mount
 Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOIC W EP
 Base Part Number: MM908E626
1000
Order

1000+:

$3.5636

 MM908E626AVPEKR2-ND Datasheet
MM908E624AYPEWR2 MM908E624AYPEWR
2-ND		 MM908E624AYPEWR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

1000+:

$3.0958

 MM908E624AYPEWR2-ND Datasheet
MM908E624ACDWB MM908E624ACDWB-
ND		 MM908E624ACDWB NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACDWB-ND Datasheet
MM908E624AYPEW MM908E624AYPEW-
ND		 MM908E624AYPEW NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624AYPEW-ND Datasheet
MM908E625ACEK MM908E625ACEK-N
D		 MM908E625ACEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Obsolete
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 13
 Voltage - Supply: 8 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E625
1000
Order

--

 MM908E625ACEK-ND Datasheet
MM908E622ACPEK MM908E622ACPEK-
ND		 MM908E622ACPEK NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 12
 Voltage - Supply: 9 V ~ 16 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
 Supplier Device Package: 54-SOICW-EP
 Base Part Number: MM908E622
1000
Order

--

 MM908E622ACPEK-ND Datasheet
MM912H634CM1AER2 MM912H634CM1AER
2-ND		 MM912H634CM1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Obsolete
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (64 kB)
 Controller Series: HCS12
 RAM Size: 6K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.25 V
 Operating Temperature: -40C ~ 125C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912H634
1000
Order

1+:

$0

 MM912H634CM1AER2-ND Datasheet
MM908E624ACPEW MM908E624ACPEW-
ND		 MM908E624ACPEW NXP USA Inc
View more  Packaging: Tube
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACPEW-ND Datasheet
MM912G634DM1AER2 MM912G634DM1AER
2-ND		 MM912G634DM1AER
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive
 Core Processor: S12
 Program Memory Type: FLASH (48 kB)
 Controller Series: HCS12
 RAM Size: 2K x 8
 Interface: LIN, SCI
 Number of I/O: 9
 Voltage - Supply: 2.25 V ~ 5.5 V
 Operating Temperature: -40C ~ 105C
 Mounting Type: Surface Mount
 Package / Case: 48-LQFP Exposed Pad
 Supplier Device Package: 48-LQFP-EP (7x7)
 Base Part Number: MM912G634
1000
Order

2000+:

$3.913

 MM912G634DM1AER2-ND Datasheet
MM908E624ACPEWR2 MM908E624ACPEWR
2-ND		 MM908E624ACPEWR
2		 NXP USA Inc
View more  Packaging: Tape & Reel (TR)
 Part Status: Active
 Applications: Automotive Mirror Control
 Core Processor: HC08
 Program Memory Type: FLASH (16 kB)
 Controller Series: 908E
 RAM Size: 512 x 8
 Interface: SCI, SPI
 Number of I/O: 16
 Voltage - Supply: 5.5 V ~ 18 V
 Operating Temperature: -40C ~ 85C
 Mounting Type: Surface Mount
 Package / Case: 54-BSSOP (0.295", 7.50mm Width)
 Supplier Device Package: 54-SOIC
 Base Part Number: MM908E624
1000
Order

--

 MM908E624ACPEWR2-ND Datasheet
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