Chip capacitor - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
IPC0004-S-ND	IPC0004-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 12 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Thermal Center Pad: 0.062" L x 0.110" W (1.58mm x 2.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0127-S-ND	IPC0127-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 12 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.098" L x 0.157" W (2.50mm x 4.00mm) Thermal Center Pad: 0.077" L x 0.096" W (1.95mm x 2.45mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0048-S-ND	PA0048-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 5 Pitch: 0.037" (0.95mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.039" L x 0.197" W (1.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDLTLFP-ND	SMDLTLFP	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Melting Point: 281F (138C) Flux Type: No-Clean Process: Lead Free Form: Syringe, 0.53 oz (15g), 5cc Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1062 Order	1+: $10.0485
SMD4300SNL10-ND	SMD4300SNL10	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: Water Soluble Process: Lead Free Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.077 lb (34.93g)	101 Order	1+: $17.0037
PA0017-ND	PA0017	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SSOP Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	90 Order	1+: $2.5767
FPC080P020-ND	FPC080P020	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: FPC Connector Number of Positions: 20 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm)	1000 Order	1+: $3.0177
PA0188-ND	PA0188	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: LQFP Number of Positions: 144 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm)	46 Order	1+: $9.6327
HDR100IMP40F-G- V-TH-ND	HDR100IMP40F-G- V-TH	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 40 Number of Positions Loaded: All Pitch - Mating: 0.100" (2.54mm) Number of Rows: 1 Mounting Type: Through Hole Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.335" (8.51mm) Contact Length - Post: 0.122" (3.10mm) Contact Shape: Square	2215 Order	1+: $0.6867
HDR127MET40F-G- V-SM-DR-ND	HDR127MET40F-G- V-SM-DR	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 40 Number of Positions Loaded: All Pitch - Mating: 0.050" (1.27mm) Number of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Mounting Type: Surface Mount Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.134" (3.40mm) Contact Shape: Square	1000 Order	1+: $1.6317
PA0103-ND	PA0103	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	115 Order	1+: $3.9627
IPC0037-ND	IPC0037	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.9627
PA0056-ND	PA0056	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MLP, MLF Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)	1000 Order	1+: $4.6557
PA0104-S-ND	PA0104-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MQFP Number of Positions: 52 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0023-S-ND	IPC0023-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm) Thermal Center Pad: 0.228" L x 0.228" W (5.80mm x 5.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0226-S-ND	PA0226-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 56 Pitch: 0.025" (0.64mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0076-S-ND	IPC0076-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MSOP Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.079" L x 0.110" W (2.00mm x 2.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0098-S-ND	PA0098-S	Chip Quik Inc.	View more	1000 Order	1+: $8.04
IPC0112-S-ND	IPC0112-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 24 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.157" W (7.00mm x 4.00mm) Thermal Center Pad: 0.104" L x 0.253" W (2.64mm x 6.43mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC100P010-S-ND	FPC100P010-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 10 Pitch: 0.039" (1.00mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.157" L x 0.774" W (4.00mm x 19.65mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0045-S-ND	PA0045-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: VSOP Number of Positions: 16 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
ADAPT_COMBO-ND	ADAPT_COMBO	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Kit Type: Adapter, Breakout Boards Quantity: 5 Pieces (5 Values - 1 Each) Specifications: SMD to DIP	111 Order	1+: $5.9787
IPC0062-ND	IPC0062	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.3327
MPH100IMP40M-G- V-TH-ND	MPH100IMP40M-G- V-TH	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active	106 Order	1+: $1.3167
PA0012-S-ND	PA0012-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 32 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0126-S-ND	IPC0126-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 20 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.177" L x 0.138" W (4.50mm x 3.50mm) Thermal Center Pad: 0.081" L x 0.120" W (2.05mm x 3.05mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0209-S-ND	PA0209-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSOP Number of Positions: 50 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0185-S-ND	IPC0185-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PowerSOIC Number of Positions: 28 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.130" L x 0.154" W (3.30mm x 3.90mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
TS391SNL50-ND	TS391SNL50	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Jar, 1.76 oz (50g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture	126 Order	1+: $11.3085
SMD2SWLF.0201LB -ND	SMD2SWLF.020 1L B	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.020" (0.51mm) Melting Point: 441F (227C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Lead Free Form: Spool, 1 lb (454 g) Shelf Life: Not Applicable	28 Order	1+: $37.1322 5+: $33.1808 10+: $26.8607 25+: $25.2806 50+: $23.7006
SMD291AX500T4C- ND	SMD291AX500T4C	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn63Pb37 (63/37) Melting Point: 361F (183C) Flux Type: No-Clean Process: Leaded Form: Cartridge, 17.64 oz (500g) Shelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	1000 Order	1+: $61.425
IPC0047-ND	IPC0047	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSOIC, PSOP, HSOP Number of Positions: 36 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)	1000 Order	1+: $6.2937
IPC0171-ND	IPC0171	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: BGA Number of Positions: 25 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)	1000 Order	1+: $8.1018
PA0005-S-ND	PA0005-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 16 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC030P071-S-ND	FPC030P071-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 71 Pitch: 0.012" (0.30mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC040P040-S-ND	FPC040P040-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 40 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.157" L x 0.858" W (4.00mm x 21.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0081-S-ND	PA0081-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TVSOP Number of Positions: 56 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDFP-1B10-ND	SMDFP-1B10	Chip Quik Inc.	View more Series: SMDFP Part Status: Active Type: Microgripper Hook Type: Pincer Hook, Pincer Opening: 0.031 ~ 0.020" (0.80 ~ 0.50mm) Features: 0.393" (10.00mm) Tip Length Length: 1.693" (43.00mm) Color: Green Quantity: 1 Piece	3 Order	1+: $24.0975
IPC0039-ND	IPC0039	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 16 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)	1000 Order	1+: $4.9707
IPC0032-ND	IPC0032	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.400" (25.40mm x 86.36mm)	1000 Order	1+: $10.2627

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