Chip capacitor - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
BGA0012-ND	BGA0012	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: BGA Number of Positions: 54 Pitch: 0.047" (1.20mm)	1000 Order	1+: $23.8014
PA0094-S-ND	PA0094-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 48 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	6 Order	1+: $7.56
PA0174-S-ND	PA0174-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOT/SC Number of Positions: 3 Pitch: 0.091" (2.30mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.140" L x 0.256" W (3.56mm x 6.50mm) Thermal Center Pad: 0.079" L x 0.130" W (2.00mm x 3.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0116-S-ND	PA0116-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: CSP Number of Positions: 24 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.177" W (3.50mm x 4.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0118-S-ND	IPC0118-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 100 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Thermal Center Pad: 0.398" L x 0.398" W (10.10mm x 10.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDIN97AG3-ND	SMDIN97AG3	Chip Quik Inc.	View more Series: SMD Part Status: Active Type: Wire Solder Composition: In97Ag3 (97/3) Diameter: 0.031" (0.79mm) Melting Point: 289F (143C) Wire Gauge: 20 AWG, 21 SWG Process: Lead Free Form: Spool Shelf Life: Not Applicable	24 Order	1+: $19.9899 5+: $19.5804 10+: $17.9487 25+: $14.6853 50+: $13.8694 100+: $13.0536 500+: $12.2378
HDR127MET40F-G- V-SM-DR-ND	HDR127MET40F-G- V-SM-DR	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 40 Number of Positions Loaded: All Pitch - Mating: 0.050" (1.27mm) Number of Rows: 2 Row Spacing - Mating: 0.050" (1.27mm) Mounting Type: Surface Mount Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.134" (3.40mm) Contact Shape: Square	1000 Order	1+: $1.6317
PA0103-ND	PA0103	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	115 Order	1+: $3.9627
IPC0037-ND	IPC0037	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.9627
PA0056-ND	PA0056	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MLP, MLF Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)	1000 Order	1+: $4.6557
PA0104-S-ND	PA0104-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MQFP Number of Positions: 52 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0023-S-ND	IPC0023-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm) Thermal Center Pad: 0.228" L x 0.228" W (5.80mm x 5.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0226-S-ND	PA0226-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 56 Pitch: 0.025" (0.64mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0110-ND	PA0110	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Number of Positions: 80 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)	42 Order	1+: $9.9477
PA0237-ND	PA0237	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 36 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)	1000 Order	1+: $3.6477
PA0114-ND	PA0114	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PQFP Number of Positions: 80 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)	1000 Order	1+: $9.9477
PA0201-ND	PA0201	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: PQFP Number of Positions: 160 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 2.500" L x 2.500" W (63.50mm x 63.50mm)	1000 Order	1+: $11.4093
BGA0011-ND	BGA0011	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: BGA Number of Positions: 25 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)	1000 Order	1+: $13.2237
PA0180-S-ND	PA0180-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOT/SC Number of Positions: 6 Pitch: 0.037" (0.95mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.059" W (3.00mm x 1.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0016-S-ND	PA0016-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 14 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0181-S-ND	PA0181-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOT/SC Number of Positions: 8 Pitch: 0.037" (0.95mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.130" W (4.00mm x 3.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC100P040-S-ND	FPC100P040-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 40 Pitch: 0.039" (1.00mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Thermal Center Pad: 0.157" L x 1.955" W (4.00mm x 49.65mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0186-S-ND	IPC0186-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 24 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.217" L x 0.138" W (5.50mm x 3.50mm) Thermal Center Pad: 0.081" L x 0.122" W (2.05mm x 3.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
SMD291SNLT5-ND	SMD291SNLT5	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Syringe, 0.53 oz (15g), 5cc Shelf Life: 6 Months Shelf Life Start: Date of Manufacture	41 Order	1+: $24.192 5+: $23.184 10+: $19.152 25+: $17.136 50+: $16.128 100+: $15.12
SMD2060-ND	SMD2060	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Process: Lead Free Form: Jar Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	1000 Order	1+: $68.6385
SBBSM2120-1-ND	SBBSM2120-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, Surface Mount Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Plated Surface Mount Pitch: 0.100" (2.54mm) Circuit Pattern: Pad (Square) Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	358 Order	1+: $2.6397
SMDSG10CCR-ND	SMDSG10CCR	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Accessory Type: Syringe Gun, Manual Tip - Type: Needle Tip Capacity: 10cc Number of Pieces: 1	54 Order	1+: $40.95
IPC0014-S-ND	IPC0014-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 24 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	33 Order	1+: $7.56
PA0017-S-ND	PA0017-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SSOP Number of Positions: 16 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0063-S-ND	IPC0063-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.055" L x 0.091" W (1.40mm x 2.30mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0110-S-ND	IPC0110-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Thermal Center Pad: 0.084" L x 0.084" W (2.14mm x 2.14mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC125P020-S-ND	FPC125P020-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 20 Pitch: 0.049" (1.25mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Thermal Center Pad: 0.157" L x 1.364" W (4.00mm x 34.65mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
DC1210S-10X-ND	DC1210S-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: 1210 Number of Positions: 2 Board Thickness: 0.031" (0.79mm) 1/32" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.400" (10.16mm x 10.16mm)	44 Order	1+: $3.087
PA0012-ND	PA0012	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $4.0257
IPC0146-ND	IPC0146	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)	1000 Order	1+: $9.9477
SBBTH1508-1-ND	SBBTH1508-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Plated Through Hole (PTH) Pitch: 0.100" (2.54mm) Circuit Pattern: Pad Per Hole (Round) Hole Diameter: 0.039" (1.00mm) Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	1578 Order	1+: $1.0017
PA0067-S-ND	PA0067-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0194-S-ND	PA0194-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TSSOP Number of Positions: 20 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.173" L x 0.256" W (4.40mm x 6.50mm) Thermal Center Pad: 0.118" L x 0.492" W (3.00mm x 12.50mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0037-S-ND	IPC0037-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 12 Pitch: 0.016" (0.40mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.087" L x 0.055" W (2.20mm x 1.40mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0122-S-ND	PA0122-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LQFP Number of Positions: 128 Pitch: 0.020" (0.50mm) Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm) Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459

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