Insignis memory chip - Allicdata Electronics

Related Categories

< 39 40 41 42 43 >

Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
SMDSWLF.020.4OZ -ND	SMDSWLF.020 .4O Z	Chip Quik Inc.	View more Series: SMD Part Status: Active Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.020" (0.51mm) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Lead Free Form: Tube, 0.4 oz (11.34g) Shelf Life: Not Applicable	96 Order	1+: $11.7495 5+: $11.5151 10+: $11.0445 25+: $9.3996 50+: $8.4596 100+: $7.9897 500+: $7.0497
PA0142-S-ND	PA0142-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LLP Number of Positions: 32 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
DC1411J-10X-ND	DC1411J-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to Plated Through Hole Package Accepted: 1411 Number of Positions: 2 Pitch: 0.114" (2.90mm) Material: FR4 Epoxy Glass Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)	95 Order	1+: $3.4713 5+: $3.3806 10+: $3.2886 25+: $3.1974 50+: $3.0146 100+: $2.9232 250+: $2.7405
IPC0161-ND	IPC0161	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 10 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)	1000 Order	1+: $4.1517
IPC0192-ND	IPC0192	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 36 Pitch: 0.035" (0.90mm)	1000 Order	1+: $7.6797
PA0174-ND	PA0174	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOT-223 Number of Positions: 4 Pitch: 0.091" (2.30mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	118 Order	1+: $1.6947
PA0060-ND	PA0060	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN THIN Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	211 Order	1+: $3.0177
IPC0051-ND	IPC0051	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PowerSOIC, PSOP, HSOP Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	342 Order	1+: $3.3327
PA0063-ND	PA0063	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	134 Order	1+: $3.3327
PA0210-ND	PA0210	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TSOP Number of Positions: 54 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)	76 Order	1+: $5.9787
PA0104-ND	PA0104	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LQFP, MQFP, TQFP Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)	1000 Order	1+: $8.9397
SBB2808-1-ND	SBB2808-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Proto Board Type: Breadboard, General Purpose Moisture Sensitivity Level (MSL): 1 (Unlimited) Plating: Non-Plated Through Hole (NPTH) Pitch: 0.100" (2.54mm) Circuit Pattern: 3 Hole Pad (Single Side) Hole Diameter: 0.039" (1.00mm) Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm) Material: FR4 Epoxy Glass	352 Order	1+: $2.3247
BGA0009-S-ND	BGA0009-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 484 Pitch: 0.050" (1.27mm) Outer Dimension: 1.800" L x 2.600" W (45.72mm x 66.04mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	3 Order	1+: $13.2237
IPC0113-S-ND	IPC0113-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 20 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.067" L x 0.067" W (1.70mm x 1.70mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0148-S-ND	PA0148-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LLP Number of Positions: 56 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
BGA0007-S-ND	BGA0007-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 100 Pitch: 0.050" (1.27mm) Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	4 Order	1+: $13.2237
HVPB6-ND	HVPB6	Chip Quik Inc.	View more Part Status: Active Accessory Type: Vacuum Tool with Tips	238 Order	1+: $9.9225
BGA0023-S-ND	BGA0023-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: BGA Number of Positions: 100 Pitch: 0.016" (0.40mm) Outer Dimension: 1.350" L x 1.950" W (34.29mm x 49.53mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	19 Order	1+: $13.2237
PA0096-S-ND	PA0096-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 64 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	6 Order	1+: $7.56
IPC0096-S-ND	IPC0096-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 12 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0134-S-ND	PA0134-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LLP Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Thermal Center Pad: 0.063" L x 0.236" W (1.60mm x 6.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0014-S-ND	PA0014-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOIC Number of Positions: 54 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.950" W (22.86mm x 49.53mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0244-S-ND	PA0244-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TO/DPAK Number of Positions: 5 Pitch: 0.045" (1.15mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.256" L x 0.244" W (6.50mm x 6.20mm) Thermal Center Pad: 0.276" L x 0.236" W (7.00mm x 6.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0191-S-ND	IPC0191-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: RN Number of Positions: 32 Pitch: 0.047" (1.20mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $8.1459
SMD2SWLF.0158OZ -ND	SMD2SWLF.015 8O Z	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.015" (0.38mm) Melting Point: 441F (227C) Flux Type: No-Clean, Water Soluble Wire Gauge: 27 AWG, 28 SWG Process: Lead Free Form: Spool, 8 oz (227g), 1/2 lb Shelf Life: Not Applicable	68 Order	1+: $13.7214
IPC0142-ND	IPC0142	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOP Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)	124 Order	1+: $2.1987
IPC0078-ND	IPC0078	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: MSOP Number of Positions: 12 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)	274 Order	1+: $3.9627
DR050D254P040-N D	DR050D254P040	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass	36 Order	1+: $4.77
PA0206-ND	PA0206	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)	1000 Order	1+: $3.3327
SMD291NL-ND	SMD291NL	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	2292 Order	1+: $7.5285
IPC0109-S-ND	IPC0109-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 28 Pitch: 0.024" (0.60mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
DC0805T-10X-ND	DC0805T-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: 0805 Number of Positions: 2 Board Thickness: 0.031" (0.79mm) 1/32" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.100" (10.16mm x 2.54mm)	236 Order	1+: $3.087
IPC0123-ND	IPC0123	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)	1000 Order	1+: $3.0177
PA0120-ND	PA0120	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: CSP, TCSP Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $6.2937
PA0106-ND	PA0106	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	1000 Order	1+: $7.3017
IPC0133-ND	IPC0133	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TQFP Number of Positions: 64 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)	1000 Order	1+: $9.9477
HDR100IMP40M-G- RA-TH-ND	HDR100IMP40M-G- RA-TH	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header, Breakaway Contact Type: Male Pin Pitch - Mating: 0.100" (2.54mm) Number of Positions: 40 Number of Rows: 1 Number of Positions Loaded: All Style: Board to Board Shrouding: Unshrouded Mounting Type: Through Hole, Right Angle Termination: Wire Wrap Fastening Type: Push-Pull Contact Length - Mating: 0.236" (6.00mm) Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.098" (2.50mm) Contact Shape: Square Contact Finish - Mating: Gold Contact Finish - Post: Gold	269 Order	1+: $0.4977
PA0085-S-ND	PA0085-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: SOT/SC Number of Positions: 6 Pitch: 0.037" (0.95mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0079-S-ND	IPC0079-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: MSOP Number of Positions: 16 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Thermal Center Pad: 0.063" L x 0.118" W (1.60mm x 3.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PA0026-S-ND	PA0026-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: uMAX Number of Positions: 8 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017

< 39 40 41 42 43 >

Hot Searches: insignis memory chip everspin memory chip intel memory chip ic memory chip integrated circuit memory chip memory ic chip flash memory chip ic flash memory chip flash memory ic chip nte memory ic chip ic memory chip mostek 8509 memory chip ic calcusled memory ic chip identify ic memory chips memory chip ic pinout memory chip ic ponout sound ic chips memory 1nvo4d memory chip ic stm memory chip ic ic memory card chip

Search Result:insignis memory chip

Related Categories