Insignis memory chip - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
PA0029-S-ND	PA0029-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QSOP Number of Positions: 20 Pitch: 0.025" (0.64mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD291SNL10-ND	SMD291SNL10	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: No-Clean Process: Lead Free Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.077 lb (34.93g)	465 Order	1+: $15.7437
SMD3SW.020.4OZ- ND	SMD3SW.020 .4OZ	Chip Quik Inc.	View more Series: SMD3 Part Status: Active Type: Wire Solder Composition: Sn62Pb36Ag2 (62/36/2) Diameter: 0.020" (0.51mm) Melting Point: 354F (179C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Leaded Form: Tube, 0.4 oz (11.34g) Shelf Life: Not Applicable	99 Order	1+: $10.2249 5+: $10.017 10+: $9.6088 25+: $8.1774 50+: $7.3597 100+: $6.9508 500+: $6.1331
F127T254P05-ND	F127T254P05	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Plated Through Hole to Plated Through Hole Number of Positions: 5 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	103 Order	1+: $0.8127
IPC0017-ND	IPC0017	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: QFN Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)	1000 Order	1+: $5.9787
FPC040P080-ND	FPC040P080	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: FPC Connector Number of Positions: 80 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.100" x 4.050" (27.94mm x 102.87mm)	1000 Order	1+: $6.9867
PA0230-ND	PA0230	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: TQFP Number of Positions: 56 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)	1000 Order	1+: $8.9397
SMDTCLF-ND	SMDTCLF	Chip Quik Inc.	View more Series: CHIPQUIK Part Status: Active Type: Tip Tinner (Activator) For Use With/Related Products: Soldering Irons, Workstands	1019 Order	1+: $4.8195
PA0114-S-ND	PA0114-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: PQFP Number of Positions: 80 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0133-S-ND	IPC0133-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: TQFP Number of Positions: 64 Pitch: 0.039" (1.00mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.551" L x 0.787" W (14.00mm x 20.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMDSW.0318OZ-ND	SMDSW.031 8OZ	Chip Quik Inc.	View more Part Status: Active Type: Wire Solder Composition: Sn63Pb37 (63/37) Diameter: 0.031" (0.79mm) Melting Point: 361F (183C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Leaded Form: Spool, 8 oz (227g), 1/2 lb Shelf Life: Not Applicable	35 Order	1+: $8.757
SMD4300SNL10T5- ND	SMD4300SNL10T5	Chip Quik Inc.	View more Part Status: Active Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Flux Type: Water Soluble Process: Lead Free Form: Syringe, 1.23 oz (35g), 10cc Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37F ~ 46F (3C ~ 8C) Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Weight: 0.077 lb (34.93g)	22 Order	1+: $24.5385
SMD2050-25000-N D	SMD2050-25000	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Melting Point: 423 ~ 428F (217 ~ 220C) Process: Lead Free Form: Jar Shelf Life: 24 Months Shelf Life Start: Date of Manufacture	10 Order	1+: $22.8438 5+: $22.3776 10+: $20.5128 25+: $16.7832 50+: $15.8508 100+: $14.9184
F200T254P16-ND	F200T254P16	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Plated Through Hole to Plated Through Hole Number of Positions: 16 Pitch: 0.079" (2.00mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass	101 Order	1+: $1.8837
PA0086-ND	PA0086	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOT-23, SC-59, SC-74A Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)	777 Order	1+: $1.6947
FPC100P020-ND	FPC100P020	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: FPC Connector Number of Positions: 20 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm)	202 Order	1+: $3.0177
PA0107-ND	PA0107	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)	91 Order	1+: $9.2547
PA0189-ND	PA0189	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to PGA Package Accepted: LQFP Number of Positions: 176 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)	38 Order	1+: $10.2627
IPC0064-ND	IPC0064	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)	1000 Order	1+: $3.3327
IPC0069-ND	IPC0069	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)	1000 Order	1+: $3.6477
PA0014-ND	PA0014	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOIC Number of Positions: 54 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)	1000 Order	1+: $4.7817
PA0068-S-ND	PA0068-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.026" (0.65mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
FPC050P050-S-ND	FPC050P050-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: FPC/FFC Number of Positions: 50 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Thermal Center Pad: 0.157" L x 1.291" W (4.00mm x 32.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0103-S-ND	IPC0103-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: LGA Number of Positions: 10 Pitch: 0.050" (1.27mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.118" L x 0.197" W (3.00mm x 5.00mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
SMD2SW.020.4OZ- ND	SMD2SW.020 .4OZ	Chip Quik Inc.	View more Series: SMD2 Part Status: Active Type: Wire Solder Composition: Sn60Pb40 (60/40) Diameter: 0.020" (0.51mm) Melting Point: 361 ~ 370F (183 ~ 188C) Flux Type: No-Clean, Water Soluble Wire Gauge: 24 AWG, 25 SWG Process: Leaded Form: Tube, 0.4 oz (11.34g) Shelf Life: Not Applicable	95 Order	1+: $6.1362 5+: $6.0165 10+: $5.7758 25+: $5.0539 50+: $4.5725 100+: $4.3319 500+: $3.8506 1000+: $3.6099
HDR200MET20F-G- V-SM-DR-ND	HDR200MET20F-G- V-SM-DR	Chip Quik Inc.	View more Series: Proto-Advantage Packaging: Bulk Part Status: Active Connector Type: Header Contact Type: Female Socket Style: Board to Board Number of Positions: 20 Number of Positions Loaded: All Pitch - Mating: 0.079" (2.00mm) Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Mounting Type: Surface Mount Termination: Solder Fastening Type: Push-Pull Contact Finish - Mating: Gold Insulation Height: 0.181" (4.60mm) Contact Shape: Square	1000 Order	1+: $1.1277
IPC0020-S-ND	IPC0020-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 32 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.56
IPC0061-S-ND	IPC0061-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: DFN Number of Positions: 8 Pitch: 0.020" (0.50mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Thermal Center Pad: 0.031" L x 0.057" W (0.80mm x 1.45mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
IPC0015-S-ND	IPC0015-S	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Type: QFN/LFCSP Number of Positions: 24 Pitch: 0.031" (0.80mm) Outer Dimension: 0.900" L x 1.300" W (22.86mm x 33.02mm) Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm) Thermal Center Pad: 0.150" L x 0.150" W (3.80mm x 3.80mm) Material: Stainless Steel Thickness: 0.0040" (0.102mm)	1000 Order	1+: $7.3017
PCB3007-1-ND	PCB3007-1	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOT-23 Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)	720 Order	1+: $1.3167
CN0002-ND	CN0002	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: Connector to DIP Package Accepted: HDMI Number of Positions: 19 Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)	100 Order	1+: $6.6087
IPC0068-ND	IPC0068	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)	1000 Order	1+: $3.6477
PA0102-ND	PA0102	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)	1000 Order	1+: $3.9627
IPC0176-ND	IPC0176	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: DFN Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Material: FR4 Epoxy Glass Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)	1000 Order	1+: $4.5108
IPC0109-ND	IPC0109	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LGA Number of Positions: 28 Pitch: 0.024" (0.60mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)	1000 Order	1+: $7.3017
SMD3SW.0311LB-N D	SMD3SW.031 1LB	Chip Quik Inc.	View more Series: SMD3 Part Status: Active Type: Wire Solder Composition: Sn62Pb36Ag2 (62/36/2) Diameter: 0.031" (0.79mm) Melting Point: 354F (179C) Flux Type: No-Clean, Water Soluble Wire Gauge: 20 AWG, 22 SWG Process: Leaded Form: Spool, 1 lb (454 g) Shelf Life: Not Applicable	32 Order	1+: $44.1189 5+: $39.4254 10+: $31.9158 25+: $30.0384 50+: $28.161
LS0003-ND	LS0003	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: SOT-23 Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)	190 Order	1+: $0.3717
DC0805S-10X-ND	DC0805S-10X	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: 0805 Number of Positions: 2 Board Thickness: 0.031" (0.79mm) 1/32" Material: FR4 Epoxy Glass Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)	21 Order	1+: $3.087
PA0173-ND	PA0173	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: PSOP Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	1000 Order	1+: $2.0097
PA0134-ND	PA0134	Chip Quik Inc.	View more Series: Proto-Advantage Part Status: Active Proto Board Type: SMD to DIP Package Accepted: LLP Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Material: FR4 Epoxy Glass Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)	1000 Order	1+: $2.6397

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