Microsemi microcontroller ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
M2S100TS-1FCG11 52I-ND	M2S100TS-1FCG11 52I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100TS	1000 Order	1+: $0
A2F500M3G-1PQ20 8-ND	A2F500M3G-1PQ20 8	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	24+: $34.2922
A2F200M3F-1FG25 6I-ND	A2F200M3F-1FG25 6I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
M2S100-FC1152-N D	M2S100-FC1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100	1000 Order	1+: $0
M2S150-FCG1152- ND	M2S150-FCG1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150	1000 Order	24+: $161.639
A2F060M3E-1FG25 6M-ND	A2F060M3E-1FG25 6M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
1100-1001-ND	A2F200M3F-1FGG4 84	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 94 Base Part Number: A2F200	1000 Order	--
A2F200M3F-1FGG4 84I-ND	A2F200M3F-1FGG4 84I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 94 Base Part Number: A2F200	1000 Order	--
M2S100S-1FCG115 2I-ND	M2S100S-1FCG115 2I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100S	1000 Order	1+: $0
A2F200M3F-PQ208 -ND	A2F200M3F-PQ208	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	--
A2F200M3F-1PQ20 8I-ND	A2F200M3F-1PQ20 8I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	24+: $24.5774
A2F200M3F-1PQG2 08I-ND	A2F200M3F-1PQG2 08I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
A2F200M3F-FG256 I-ND	A2F200M3F-FG256 I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	--
A2F060M3E-1CSG2 88I-ND	A2F060M3E-1CSG2 88I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11) Number of I/O: MCU - 28, FPGA - 68 Base Part Number: A2F060M3E	1000 Order	1+: $0
1100-1010-ND	A2F500M3G-FGG48 4	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 128 Base Part Number: A2F500M3G	1000 Order	1+: $40.7295 10+: $38.3342 100+: $34.2612
A2F060M3E-1FGG2 56-ND	A2F060M3E-1FGG2 56	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F200M3F-1CS28 8-ND	A2F200M3F-1CS28 8	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11) Number of I/O: MCU - 31, FPGA - 78 Base Part Number: A2F200	1000 Order	176+: $20.3364
M2S150-1FCG1152 -ND	M2S150-1FCG1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150	1000 Order	24+: $197.441
M2S150T-FCG1152 -ND	M2S150T-FCG1152	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150T	1000 Order	24+: $189.546
M2S150-1FC1152I -ND	M2S150-1FC1152I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S150	1000 Order	24+: $208.321
A2F500M3G-FGG25 6M-ND	A2F500M3G-FGG25 6M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
1100-1000-ND	A2F200M3F-1FGG2 56	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
A2F200M3F-PQG20 8I-ND	A2F200M3F-PQG20 8I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
A2F200M3F-CS288 I-ND	A2F200M3F-CS288 I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11) Number of I/O: MCU - 31, FPGA - 78 Base Part Number: A2F200	1000 Order	1+: $0
M2S100T-1FCG115 2I-ND	M2S100T-1FCG115 2I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100T	1000 Order	1+: $0
1100-1005-ND	A2F200M3F-PQG20 8	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	--
A2F500M3G-1FG25 6I-ND	A2F500M3G-1FG25 6I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
A2F060M3E-1CS28 8I-ND	A2F060M3E-1CS28 8I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11) Number of I/O: MCU - 28, FPGA - 68 Base Part Number: A2F060M3E	1000 Order	1+: $0
M2S100S-1FC1152 I-ND	M2S100S-1FC1152 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 100K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35) Number of I/O: 574 Base Part Number: M2S100S	1000 Order	1+: $0
A2F500M3G-CS288 -ND	A2F500M3G-CS288	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11) Number of I/O: MCU - 31, FPGA - 78 Base Part Number: A2F500M3G	1000 Order	176+: $27.6937
A2F500M3G-1FG48 4-ND	A2F500M3G-1FG48 4	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 128 Base Part Number: A2F500M3G	1000 Order	--
A2F500M3G-FG256 -ND	A2F500M3G-FG256	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	--
A2F060M3E-TQG14 4I-ND	A2F060M3E-TQG14 4I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: MCU - 21, FPGA - 33 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F500M3G-FG256 M-ND	A2F500M3G-FG256 M	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -55C ~ 125C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
A2F500M3G-CS288 I-ND	A2F500M3G-CS288 I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11) Number of I/O: MCU - 31, FPGA - 78 Base Part Number: A2F500M3G	1000 Order	176+: $32.3963
A2F060M3E-TQG14 4-ND	A2F060M3E-TQG14 4	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: MCU - 21, FPGA - 33 Base Part Number: A2F060M3E	1000 Order	1+: $0
A2F500M3G-1CS28 8I-ND	A2F500M3G-1CS28 8I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 288-TFBGA, CSPBGA Supplier Device Package: 288-CSP (11x11) Number of I/O: MCU - 31, FPGA - 78 Base Part Number: A2F500M3G	1000 Order	1+: $0
A2F200M3F-1FG48 4I-ND	A2F200M3F-1FG48 4I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 94 Base Part Number: A2F200	1000 Order	--
1100-1009-ND	A2F500M3G-FGG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	--
A2F500M3G-1PQG2 08-ND	A2F500M3G-1PQG2 08	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0

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