A2F060M3E-TQG144I Allicdata Electronics
Allicdata Part #:

A2F060M3E-TQG144I-ND

Manufacturer Part#:

A2F060M3E-TQG144I

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 60K GATES 128KB 144-TQFP
More Detail: ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusio...
DataSheet: A2F060M3E-TQG144I datasheetA2F060M3E-TQG144I Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: SmartFusion®
Packaging: Tray 
Part Status: Obsolete
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I²C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: MCU - 21, FPGA - 33
Base Part Number: A2F060M3E
Description

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System On Chip (SoC) refers to a type of IC that integrates various kinds of circuits and components within a single IC. It consolidates a wide variety of functions, including analog and digital electronic components, into a single package, which connects to an assortment of functional blocks on the chip. The A2F060M3E-TQG144I is an example of such a System On Chip. In this article, we will discuss its application field and working principle.

Application Field

The A2F060M3E-TQG144I SoC is designed for applications in the consumer electronics and embedded systems market. It is a low-power, high-performance SoC that integrates multiple hardware and software components for a variety of applications. It can be used in a wide range of devices, including set-top boxes, communications equipment, and consumer electronics. The SoC is ideal for applications where power efficiency is paramount. It supports multiple interfaces and communication protocols, simplifying the development of multimedia applications.

Working Principle

The A2F060M3E-TQG144I SoC takes advantage of a hierarchical design approach, which means it is made up of multiple cascading levels. At the top level, the SoC contains the Application Processor core, which is used to execute the various functions in the device. The Application Processor core is the main processor in the SoC, and it is responsible for carrying out all of the algorithms and operations required by the device. The Application Processor core is then connected to other modules within the SoC, such as memory, I/O, power management, and analog/mixed signal components.

The I/O module is responsible for managing communication between the Application Processor core and external devices, such as displays, keypads, and other peripheral devices. The I/O module contains an array of ports that can be configured to support various communication protocols, such as Ethernet, USB, and other digital protocols. The power management module is responsible for ensuring that the SoC remains in a power-efficient state by managing the SoC\'s clock speed, voltage, and other power-related functions. Finally, the analog/mixed signal components provide the SoC with analog capabilities, such as audio and video processing, as well as other digital signals, such as clocks and reset signals.

The A2F060M3E-TQG144I SoC is a powerful and flexible solution for applications in the consumer electronics and embedded systems markets. Its hierarchical design approach enables it to integrate multiple hardware and software components, while its multiple interfaces and communication protocols simplify the development of multimedia applications. It also offers excellent power efficiency and is capable of supporting a variety of digital and analog signals.

The specific data is subject to PDF, and the above content is for reference

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