Microsemi telecom interface - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
APT40DS04HJ-ND	APT40DS04HJ	Microsemi Corporation	View more Packaging: Bulk Part Status: Obsolete Diode Type: Single Phase Technology: Standard Voltage - Peak Reverse (Max): 45V Current - Average Rectified (Io): 40A Voltage - Forward (Vf) (Max) @ If: 580mV @ 40A Current - Reverse Leakage @ Vr: 20mA @ 45V Operating Temperature: -55C ~ 150C (TJ) Mounting Type: Chassis Mount Package / Case: SOT-227-4, miniBLOC Supplier Device Package: SOT-227	1000 Order	1+: $0
CORE429-SA-ND	CORE429-SA	Microsemi Corporation	View more Series: Fusion Part Status: Active Type: FPGA For Use With/Related Products: Core429 Contents: Board(s)	1000 Order	1+: $619.92
ZLE30252-ND	ZLE30252	Microsemi Corporation	View more Part Status: Active Supplied Contents: Board(s)	1000 Order	1+: $267.246
PM2597-KIT-ND	PM2597-KIT	Microsemi Corporation	View more Series: * Part Status: Active Type: * Function: * Utilized IC / Part: * Supplied Contents: Board(s)	1000 Order	1+: $6.3
ZLR88621L-ND	ZLR88621L	Microsemi Corporation	View more Part Status: Obsolete Supplied Contents: Board(s)	1000 Order	1+: $0
1086-3054-ND	JANTXV2N2222AUA	Microsemi Corporation	View more Series: Military, MIL-PRF-19500/255 Packaging: Bulk Part Status: Active Transistor Type: NPN Current - Collector (Ic) (Max): 800mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V Power - Max: 500mW Operating Temperature: -65C ~ 200C (TJ) Mounting Type: Surface Mount Package / Case: 4-SMD, No Lead Supplier Device Package: 4-SMD	27 Order	1+: $28.6839 10+: $26.8223 25+: $24.8069
APTC80A15SCTG-N D	APTC80A15SCTG	Microsemi Corporation	View more Packaging: Bulk Part Status: Active FET Type: 2 N-Channel (Half Bridge) FET Feature: Standard Drain to Source Voltage (Vdss): 800V Current - Continuous Drain (Id) @ 25C: 28A Rds On (Max) @ Id, Vgs: 150 mOhm @ 14A, 10V Vgs(th) (Max) @ Id: 3.9V @ 2mA Gate Charge (Qg) (Max) @ Vgs: 180nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 4507pF @ 25V Power - Max: 277W Operating Temperature: -40C ~ 150C (TJ) Mounting Type: Chassis Mount Package / Case: SP4 Supplier Device Package: SP4	1000 Order	100+: $49.5088
1259-1067-ND	SG1544J-DESC	Microsemi Corporation	View more Series: Military, MIL-STD-883 Packaging: Tube Part Status: Active Type: Power Supply Monitor Number of Voltages Monitored: 1 Output: Open Drain or Open Collector Voltage - Threshold: 2.5V Operating Temperature: -55C ~ 125C (TA) Mounting Type: Through Hole Package / Case: 18-DIP Supplier Device Package: 18-DIP	1000 Order	1+: $0
VSC8564XKS-14-N D	VSC8564XKS-14	Microsemi Corporation	View more Series: * Part Status: Active	1000 Order	90+: $24.9837
PM4329-BGI-ND	PM4329-BGI	Microsemi Corporation	View more Series: * Part Status: Discontinued at Digi-Key	1000 Order	1+: $0
M2S010T-VFG256I -ND	M2S010T-VFG256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $23.0485
M2S010S-1TQG144 -ND	M2S010S-1TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
M2S050TS-1FGG89 6-ND	M2S050TS-1FGG89 6	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377	1000 Order	27+: $92.085
M2S060T-1FGG484 M-ND	M2S060T-1FGG484 M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $159.393
M2S150-FCSG536- ND	M2S150-FCSG536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $165.008
A2F060M3E-1FGG2 56I-ND	A2F060M3E-1FGG2 56I	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 26, FPGA - 66 Base Part Number: A2F060M3E	1000 Order	1+: $0
M2S050S-1FGG484 I-ND	M2S050S-1FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S050S	1000 Order	1+: $0
MS2608H-ND	MS2608H	Microsemi Corporation	View more Series: * Part Status: Obsolete	1000 Order	1+: $0
MSC040SMA120B-N D	MSC040SMA120B	Microsemi Corporation	View more Series: * Part Status: Active	1000 Order	17+: $20.8489
APTRG8A120G-ND	APTRG8A120G	Microsemi Corporation	View more Packaging: Bulk Part Status: Obsolete Driven Configuration: Half-Bridge Channel Type: Independent Number of Drivers: 2 Gate Type: IGBT Voltage - Supply: 14.5 V ~ 15.5 V Logic Voltage - VIL, VIH: 0.8V, 2V Current - Peak Output (Source, Sink): 8A, 8A Input Type: Non-Inverting High Side Voltage - Max (Bootstrap): 1200V Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
LX5506LQ-ND	LX5506LQ	Microsemi Corporation	View more Part Status: Obsolete Frequency: 4.5GHz ~ 6GHz P1dB: 26dBm Gain: 21dB RF Type: 802.11a Voltage - Supply: 3.3V Current - Supply: 200mA Test Frequency: 6GHz	1000 Order	--
LXM1623-05-44-N D	LXM1623-05-44	Microsemi Corporation	View more Series: LXM1623-05-4x Part Status: Obsolete Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant Voltage - Input: 5V Moisture Sensitivity Level (MSL): 1 (Unlimited) Output: 1500V Type: CCFL and UV Lamps Size / Dimension: 4.53" L x 1.18" W x 0.26" H (115mm x 30mm x 6.5mm) Mounting Type: Chassis Mount	1000 Order	1+: $0
LX9507G-ND	LX9507G	Microsemi Corporation	View more Part Status: Obsolete Accessory Type: Lamp - Input Connector Cable Assembly For Use With/Related Products: Linfinity Backlight Inverter Board	1000 Order	1+: $0
MT8816AE1-ND	MT8816AE1	Microsemi Corporation	View more Packaging: Tube Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Applications: Telecommunications Multiplexer/Demultiplexer Circuit: 8:16 Number of Channels: 1 On-State Resistance (Max): 65 Ohm Voltage - Supply, Single (V+): 4.5 V ~ 13.2 V Voltage - Supply, Dual (V): 4.5 V -3db Bandwidth: 45MHz Operating Temperature: -40C ~ 85C (TA) Package / Case: 40-DIP (0.600", 15.24mm) Supplier Device Package: 40-PDIP	1000 Order	117+: $5.4973
LX8385-05CDD-ND	LX8385-05CDD	Microsemi Corporation	View more Packaging: Tube Part Status: Obsolete Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 10V Voltage - Output (Min/Fixed): 5V Voltage Dropout (Max): 1.5V @ 3A Current - Output: 3A Current - Quiescent (Iq): 10mA PSRR: 83dB (120Hz) Protection Features: Over Current, Over Temperature Operating Temperature: 0C ~ 125C Mounting Type: Surface Mount Package / Case: TO-263-4, DPak (3 Leads + Tab), TO-263AA Supplier Device Package: TO-263, Power Base Part Number: LX8385	1000 Order	1+: $0
LX8385-05CP-ND	LX8385-05CP	Microsemi Corporation	View more Packaging: Tube Part Status: Obsolete Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 10V Voltage - Output (Min/Fixed): 5V Voltage Dropout (Max): 1.5V @ 3A Current - Output: 3A Current - Quiescent (Iq): 10mA PSRR: 83dB (120Hz) Protection Features: Over Current, Over Temperature Operating Temperature: 0C ~ 125C Mounting Type: Through Hole Package / Case: TO-220-3 Supplier Device Package: TO-220, Power Base Part Number: LX8385	1000 Order	1+: $0
1100-1024-ND	A3P125-TQG144	Microsemi Corporation	View more Series: ProASIC3 Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Total RAM Bits: 36864 Moisture Sensitivity Level (MSL): 3 (168 Hours) Number of I/O: 100 Number of Gates: 125000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Base Part Number: A3P125	660 Order	--
M2S050T-FCSG325 -ND	M2S050T-FCSG325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $49.4991
M2S060T-1FG484- ND	M2S060T-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $74.4296
M2S060TS-1FG676 I-ND	M2S060TS-1FG676 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $92.085
M2S050T-1FG896I -ND	M2S050T-1FG896I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050T	1000 Order	27+: $92.085
M2S150-FCS536-N D	M2S150-FCS536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $165.008
M2S090S-1FG676I -ND	M2S090S-1FG676I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 425 Base Part Number: M2S090S	1000 Order	1+: $0
LX8382A-00CP-ND	LX8382A-00CP	Microsemi Corporation	View more Packaging: Tube Part Status: Obsolete Output Configuration: Positive Output Type: Adjustable Number of Regulators: 1 Voltage - Input (Max): 10V Voltage - Output (Min/Fixed): 1.25V Voltage - Output (Max): 8.6V Voltage Dropout (Max): 1.2V @ 10A Current - Output: 10A PSRR: 83dB (120Hz) Protection Features: Over Current, Over Temperature Operating Temperature: 0C ~ 125C Mounting Type: Through Hole Package / Case: TO-220-3 Supplier Device Package: TO-220, Power Base Part Number: LX8382	1000 Order	1+: $0
LX8382A-33CP-ND	LX8382A-33CP	Microsemi Corporation	View more Packaging: Tube Part Status: Obsolete Output Configuration: Positive	1000 Order	1+: $0
LX8383-00CP-ND	LX8383-00CP	Microsemi Corporation	View more Packaging: Tube Part Status: Obsolete Output Configuration: Positive Output Type: Adjustable Number of Regulators: 1 Voltage - Input (Max): 10V Voltage - Output (Min/Fixed): 1.25V Voltage - Output (Max): 8.5V Voltage Dropout (Max): 1.5V @ 7.5A Current - Output: 7.5A Current - Quiescent (Iq): 10mA PSRR: 83dB (120Hz) Protection Features: Over Current, Over Temperature Operating Temperature: 0C ~ 125C Mounting Type: Through Hole Package / Case: TO-220-3 Cropped Leads Supplier Device Package: TO-220, Power Base Part Number: LX8383	1000 Order	1+: $0
LX8385-05IP-ND	LX8385-05IP	Microsemi Corporation	View more Packaging: Tube Part Status: Obsolete Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 10V Voltage - Output (Min/Fixed): 5V Voltage Dropout (Max): 1.5V @ 3A Current - Output: 3A Current - Quiescent (Iq): 10mA PSRR: 83dB (120Hz) Protection Features: Over Current, Over Temperature Operating Temperature: -25C ~ 125C Mounting Type: Through Hole Package / Case: TO-220-3 Supplier Device Package: TO-220, Power Base Part Number: LX8385	1000 Order	1+: $0
1259-1149-ND	SG7912AT-883B	Microsemi Corporation	View more Series: Military, MIL-STD-883 Packaging: Bulk Part Status: Active Output Configuration: Negative Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): -35V Voltage - Output (Min/Fixed): -12V Voltage Dropout (Max): 2.3V @ 500mA Current - Output: 500mA Current - Quiescent (Iq): 4mA PSRR: 54dB (120Hz) Protection Features: Over Current, Over Temperature, Short Circuit Operating Temperature: -55C ~ 125C Mounting Type: Through Hole Package / Case: TO-205AD, TO-39-3 Metal Can Supplier Device Package: TO-39 Base Part Number: SG7912	1000 Order	1+: $0
M2S005-TQG144-N D	M2S005-TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $10.1048
M2S010-VFG256-N D	M2S010-VFG256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $19.7786

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